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Full-Text Articles in Engineering
Emi From Airflow Aperture Arrays In Shielding Enclosures-Experiments, Fdtd, And Mom Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren
Emi From Airflow Aperture Arrays In Shielding Enclosures-Experiments, Fdtd, And Mom Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Aperture arrays designed to provide airflow through shielding enclosures can provide part of the coupling path from interior sources to external electromagnetic interference (EMI). In this work, radiation through aperture arrays is investigated numerically and experimentally. FDTD modeling is compared with measurements on aperture arrays in a test enclosure. The method of moments (MoM) is also utilized to study radiation from apertures and to investigate the mutual coupling between apertures in an infinite conducting plane. A simple design equation for the relation between aperture size and number and shielding effectiveness is proposed.
Development Of A Closed-Form Expression For The Input Impedance Of Power-Ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Development Of A Closed-Form Expression For The Input Impedance Of Power-Ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series LeC circuit below the first board resonance frequency. C is the interplane capacitance and Le is an effective inductance contributed by all the cavity nodes. The effects of the layer thickness, port location, board size and the feeding wire radius on the value of Le are discussed in this study. Le can be estimated from the …
Experimental And Numerical Study Of The Radiation From Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Experimental And Numerical Study Of The Radiation From Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
This paper investigates the radiation from microstrip lines with 90-degree bends. A 1-GHz TEM cell is used to measure the radiation from microstrip lines with different kinds of bends. A full wave hybrid FEM/MoM code is used to compute the radiation. Both experimental and numerical results show that there is no significant difference between the radiation from right angle bends and bends with two 45-degree corners at frequencies and trace dimensions that are likely to be found on printed circuit boards.
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Emi Resulting From A Signal Via Transition Through Dc Power Bus-Effectiveness Of Focal Smt Decoupling, Wei Cui, Xiaoning Ye, Bruce Archambeault, Doug White, Min Li, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Signal vias are commonly used in multilayer printed circuit board (PCB) design. For a signal via transitioning through the internal power and ground planes, the return current has to jump from one reference plane to another reference plane. The discontinuity of the return current at the via excites the power and ground planes, and results in power bus noise, and can produce an EMI problem as well. Numerical methods, such as finite-difference time-domain (FDTD), moment methods (MoM), and partial element equivalent circuit (PEEC), were employed herein to study this problem. The modeled results were supported by the measurements. In addition, …