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The Affects Of High Temperature Steps On Bow, Warp And Slip Of A Wafer, Mark Klare
The Affects Of High Temperature Steps On Bow, Warp And Slip Of A Wafer, Mark Klare
Journal of the Microelectronic Engineering Conference
Bow, Warp and Slip measurements were used to characterize push/pull rates of a three inch oxidation furnace. The push/pull rates were varied from 3 to 30 inches per minute. To minimize the amount of bow, warp, and slip while still being time efficient, recommended push rates of 12 and pull rates of 3 in/mm should were found.