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Stress Analysis For Chip Scale Packages With Embedded Active Devices Under Thermal Cycling, Hyunwook Yeo

Dissertations and Theses

One of the main challenges in the electronics manufacturing and packaging development is how to integrate more functions inside the same or even smaller size. To meet the demand for higher integration, the interest toward passive and active component embedding has been increasing during the past few years. One of the main reasons for the growing interest toward embedded active components, in addition to demand for higher packaging density, is the need for better electrical performance of the component assemblies. However, it is little known how embedded IC and passives affect the reliability of IC packaging.

Solder joints have been …