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Purdue University

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Microstructure

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Full-Text Articles in Engineering

Correlating Grain Size To Radiation Damage Tolerance Of Tungsten Materials Exposed To Relevant Fusion Conditions, Sean Robert Gonderman Jul 2014

Correlating Grain Size To Radiation Damage Tolerance Of Tungsten Materials Exposed To Relevant Fusion Conditions, Sean Robert Gonderman

Open Access Theses

Tungsten remains a leading candidate for plasma facing component (PFC) in future fusion devices. This is in large part due to its strong thermal and mechanical properties. The ITER project has already chosen to use an all tungsten divertor. Despite having a high melting temperature and low erosion rate, tungsten faces a large variety of issues when subject to fusion like conditions. These include embrittlement, melting, and extreme morphology change (growth of fuzz nanostructure). The work presented here investigates mechanisms that drive surface morphology change in tungsten materials exposed to fusion relevant plasmas. Specifically, tungsten materials of different grain sizes …


Microstructural Evolution During Stress Relaxation Of Gold Thin Films, Luthfia Amra Syarbaini Jan 2013

Microstructural Evolution During Stress Relaxation Of Gold Thin Films, Luthfia Amra Syarbaini

Open Access Theses

Microstructure evolution in metal thin films for use in microelectronic devices was studied due to the formation of defects such as whiskers and hillocks that may cause problems in electrical circuits. Thin film stress relaxation can occur through a variety of processes. Understanding such mechanisms and the conditions under which certain mechanism dominate can potentially lead to the improved control of thin film stability. Studies of the 3D microstructural changes in Au thin films on silicon and other substrates with different thermal expansion coefficients aid us in understanding thin film relaxation phenomena such as hillock/whisker formation. Techniques such as in-situ …