Open Access. Powered by Scholars. Published by Universities.®
- Publication Type
Articles 1 - 5 of 5
Full-Text Articles in Engineering
Phonon Transport Analysis Of Semiconductor Nanocomposites Using Monte Carlo Simulations, Mayank Malladi
Phonon Transport Analysis Of Semiconductor Nanocomposites Using Monte Carlo Simulations, Mayank Malladi
All Theses
Nanocomposites are composite materials which incorporate nanosized particles, platelets or fibers. The addition of nanosized phases into the bulk matrix can lead to significantly different material properties compared to their macrocomposite counterparts. For nanocomposites, thermal conductivity is one of the most important physical properties. Manipulation and control of thermal conductivity in nanocomposites have impacted a variety of applications. In particular, it has been shown that the phonon thermal conductivity can be reduced significantly in nanocomposites due to the increase in phonon interface scattering while the electrical conductivity can be maintained. This extraordinary property of nanocomposites has been used to enhance …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …
Effects Of Reflow On The Interfacial Characteristics Between Zn Nanoparticles Containing Sn-3.8ag-0.7cu Solder And Copper Substrate
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to investigate the effects of zinc (Zn) nanoparticles on the interfacial intermetallic compounds (IMCs) between Sn-3.8Ag-0.7Cu (SAC) solder and Cu substrate during multiple reflow. Design/methodology/approach - The nanocomposite solders were prepared by manually mixing of SAC solder paste with varying amounts of Zn nanoparticles. The solder pastes were reflowed on a hotplate at 250 C for 45 s for up to six times. The actual Zn content after reflow was analyzed by inductively coupled plasma-optical emission spectroscopy (ICP-OES). The wetting behavior of the solders was characterized by analyzing the contact angles and …
Three-Dimensional Evolution Of Mechanical Percolation In Nanocomposites With Random Microstructures, Bethany Suzanne Fralick
Three-Dimensional Evolution Of Mechanical Percolation In Nanocomposites With Random Microstructures, Bethany Suzanne Fralick
Theses and Dissertations
One mechanism that is expected to play a large role in the enhanced, and sometimes novel, mechanical properties of nanocomposites is the probabilistic formation of percolated or connected microstructures. The majority of the models used to describe mechanical percolation have the functional form of a power law and depend on prior knowledge of a percolation threshold or critical volume fraction. While these models have been fairly accurate predictors of electrical conductivity in composites, they do not take any microstructural mechanisms, other than connectivity, into consideration. Classic mean-field micromechanics models, however, do not capture the variability in effective properties due to …