Engineering Commons^™

Molecular Dynamics Simulation Of Force-Controlled Nanoindentation, Keaton Jaramillo

Mechanical Engineering Undergraduate Honors Theses

The aim of this honors research is to develop a force-controlled nanoindentation algorithm for molecular dynamics simulation. The algorithm was tested on Silicon using the Tersoff potential and Gold using the Embedded-Atom Method (EAM) potential. The effect of varying the damping parameters that adjust the system pressure and changing run length between force iterations is explored. The force-controlled algorithm was developed and shown to be working by correlating pop-in events shown in the force versus displacement (P-h) curves to visualization software showing phase transformation or dislocation events in the sample.

Spotlight On Graphene Research From The Middle East, Kathleen A. Lehman

University Libraries Faculty Publications and Presentations

In an extension to the 2011 article “Reviews of Science for Science Librarians: Graphene” (Lehman 2011), this paper seeks to continue exploring the trend of graphene research but limits its focus to the research production of countries in the Middle East. In addition to reporting on the research output of this group of countries, this article will also examine the most prolific Middle Eastern graphene authors,their supporting institutions and funding agencies, the most cited publications from this group, the journals most used for publication of their work, and the general trend in graphene research growth in the Middle East. As …

Resonant Spectra Of Metal Nanotoroids Of Various Sizes, Huong Quynh Tran

Electrical Engineering Undergraduate Honors Theses

Nowadays, the manipulation of light by using metallic nanostructures has wide applications in photonics, optoelectronics and energy conversion. Along with other universities all over the world, the University of Arkansas is researching on nano-antennas’ design, fabrication and applications. Current research in Dr. El-Shenawee’s Terahertz Imaging and Spectroscopy Computational Electromagnetics Group, has computationally investigated the behaviors of plasmonic nanostructures by using the commercial finite element electromagnetic solver Ansys® HFSS. This work reproduced the previous work of spectral absorption enhancement of infinite and finite arrays of silver and gold nanotoroids with sizes of the inner radii: 13nm – 21nm, while outer radius …

Comparison Of Low-Temperature Co-Fired Ceramic And Direct Bonded Copper For Single Ended Primary Inductance Topology, Kristopher Cody Johnson

Electrical Engineering Undergraduate Honors Theses

This work examines the thermal dissipation characteristics of Low-Temperature Co-fired Ceramic (LTCC) and Direct Bonded Copper (DBC) with the implementation of a Single Ended Primary Inductance Converter (SEPIC) topology. The advantages and disadvantages of the two substrates will be explored in addition to a description of the design and control of the SEPIC. It will be shown that the DBC implementation is superior with regards to thermal dissipation, but that LTCC has advantages in high- density packaging, RF applications, and embedded components. These substrates and converters provide many advantages in industrial applications that include automotive and grid level implementations. Additional …

Characterization Of Silicon Phosphorus Alloy For Device Applications, Larry C. Cousar

Graduate Theses and Dissertations

A new material of highly-phosphorus doped silicon for device applications was characterized and analyzed for new material properties. Devices such as NMOS transistors and other CMOS compatible devices may benefit from new materials that reduce external resistances and increase drive currents.

Material characterization requires numerous techniques and technologies to determine electrical, optical, and physical characteristics. For this work, Hall measurement, X-ray Diffraction, Raman Spectroscopy, Photoluminescence Characterization, and Spectroscopic Ellipsometry were used to better understand this new material. The results may lead to new models for silicon phosphorus alloys.

Large-Scale Graphene Film Deposition For Monolithic Device Fabrication, Khaled Al-Shurman

Graduate Theses and Dissertations

Since 1958, the concept of integrated circuit (IC) has achieved great technological developments and helped in shrinking electronic devices. Nowadays, an IC consists of more than a million of compacted transistors.

The majority of current ICs use silicon as a semiconductor material. According to Moore's law, the number of transistors built-in on a microchip can be double every two years. However, silicon device manufacturing reaches its physical limits. To explain, there is a new trend to shrinking circuitry to seven nanometers where a lot of unknown quantum effects such as tunneling effect can not be controlled. Hence, there is an …