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Full-Text Articles in Engineering
An Alternative Approach To Nucleic Acid Memory, George D. Dickinson, Golam Md Mortuza, William Clay, Luca Piantanida, Christopher M. Green, Chad Watson, Eric J. Hayden, Tim Andersen, Wan Kuang, Elton Graugnard, Reza Zadegan, William L. Hughes
An Alternative Approach To Nucleic Acid Memory, George D. Dickinson, Golam Md Mortuza, William Clay, Luca Piantanida, Christopher M. Green, Chad Watson, Eric J. Hayden, Tim Andersen, Wan Kuang, Elton Graugnard, Reza Zadegan, William L. Hughes
Materials Science and Engineering Faculty Publications and Presentations
DNA is a compelling alternative to non-volatile information storage technologies due to its information density, stability, and energy efficiency. Previous studies have used artificially synthesized DNA to store data and automated next-generation sequencing to read it back. Here, we report digital Nucleic Acid Memory (dNAM) for applications that require a limited amount of data to have high information density, redundancy, and copy number. In dNAM, data is encoded by selecting combinations of single-stranded DNA with (1) or without (0) docking-site domains. When self-assembled with scaffold DNA, staple strands form DNA origami breadboards. Information encoded into the breadboards is read by …
Perspective On Coarse-Graining, Cognitive Load, And Materials Simulation, Eric Jankowski, Nealee Ellyson, Jenny W. Fothergill, Michael M. Henry, Mitchell H. Leibowitz, Evan D. Miller, Mone't Alberts, Jamie D. Guevara, Chris D. Jones, Mia Klopfenstein, Kendra K. Noneman, Rachel Singleton, Matthew L. Jones
Perspective On Coarse-Graining, Cognitive Load, And Materials Simulation, Eric Jankowski, Nealee Ellyson, Jenny W. Fothergill, Michael M. Henry, Mitchell H. Leibowitz, Evan D. Miller, Mone't Alberts, Jamie D. Guevara, Chris D. Jones, Mia Klopfenstein, Kendra K. Noneman, Rachel Singleton, Matthew L. Jones
Materials Science and Engineering Faculty Publications and Presentations
The predictive capabilities of computational materials science today derive from overlapping advances in simulation tools, modeling techniques, and best practices. We outline this ecosystem of molecular simulations by explaining how important contributions in each of these areas have fed into each other. The combined output of these tools, techniques, and practices is the ability for researchers to advance understanding by efficiently combining simple models with powerful software. As specific examples, we show how the prediction of organic photovoltaic morphologies have improved by orders of magnitude over the last decade, and how the processing of reacting epoxy thermosets can now be …
Enhanced Dna Sensing Via Catalytic Aggregation Of Gold Nanoparticles, Herbert M. Huttanus, Elton Graugnard, Bernard Yurke, William B. Knowlton, Wan Kuang, William L. Hughes, Jeunghoon Lee
Enhanced Dna Sensing Via Catalytic Aggregation Of Gold Nanoparticles, Herbert M. Huttanus, Elton Graugnard, Bernard Yurke, William B. Knowlton, Wan Kuang, William L. Hughes, Jeunghoon Lee
Materials Science and Engineering Faculty Publications and Presentations
A catalytic colorimetric detection scheme that incorporates a DNA-based hybridization chain reaction into gold nanoparticles was designed and tested. While direct aggregation forms an inter-particle linkagefrom only one target DNA strand, catalytic aggregation forms multiple linkages from a single target DNA strand. Gold nanoparticles were functionalized with thiol-modified DNA strands capable of undergoing hybridization chain reactions. The changes in their absorption spectra were measured at different times and target concentrations and compared against direct aggregation. Catalytic aggregation showed a multifold increase in sensitivity at low target concentrations when compared to direct aggregation. Gelelectrophoresis was performed to compare DNA hybridization reactions …
Programmable Periodicity Of Quantum Dot Arrays With Dna Origami Nanotubes, Hieu Bui, Craig Onodera, Carson Kidwell, Yerpeng Tan, Elton Graugnard, Wan Kuang, Jeunghoon Lee, William B. Knowlton, Bernard Yurke, William L. Hughes
Programmable Periodicity Of Quantum Dot Arrays With Dna Origami Nanotubes, Hieu Bui, Craig Onodera, Carson Kidwell, Yerpeng Tan, Elton Graugnard, Wan Kuang, Jeunghoon Lee, William B. Knowlton, Bernard Yurke, William L. Hughes
Materials Science and Engineering Faculty Publications and Presentations
To fabricate quantum dot arrays with programmable periodicity, functionalized DNA origami nanotubes were developed. Selected DNA staple strands were biotin-labeled to form periodic binding sites for streptavidin-conjugated quantum dots. Successful formation of arrays with periods of 43 and 71 nm demonstrates precise, programmable, large-scale nanoparticle patterning; however, limitations in array periodicity were also observed. Statistical analysis of AFM images revealed evidence for steric hindrance or site bridging that limited the minimum array periodicity.
Limitations Of Poole–Frenkel Conduction In Bilayer Hfo2/Sio2 Mos Devices, Richard G. Southwick Iii, Justin Reed, Christopher Buu, Ross Butler, Gennadi Bersuker, William B. Knowlton
Limitations Of Poole–Frenkel Conduction In Bilayer Hfo2/Sio2 Mos Devices, Richard G. Southwick Iii, Justin Reed, Christopher Buu, Ross Butler, Gennadi Bersuker, William B. Knowlton
Materials Science and Engineering Faculty Publications and Presentations
The gate leakage current of metal–oxide– semiconductors (MOSs) composed of hafnium oxide (HfO2) exhibits temperature dependence, which is usually attributed to the standard Poole–Frenkel (P–F) transport model. However, the reported magnitudes of the trap barrier height vary significantly. This paper explores the fundamental challenges associated with applying the P–F model to describe transport in HfO2/SiO2 bilayers in n/p MOS field-effect transistors composed of 3- and 5-nm HfO2 on 1.1-nm SiO2 dielectric stacks. The extracted P–F trap barrier height is shown to be dependent on several variables including the following: the temperature range, method …
Recent Advances In High Density Area Array Interconnect Bonding For 3d Integration, J. M. Lannon, J., C. Gregory, M. Lueck, A. Huffman, D. Temple, Amy J. Moll, William B. Knowlton
Recent Advances In High Density Area Array Interconnect Bonding For 3d Integration, J. M. Lannon, J., C. Gregory, M. Lueck, A. Huffman, D. Temple, Amy J. Moll, William B. Knowlton
Materials Science and Engineering Faculty Publications and Presentations
The demand for more complex and multifunctional micro systems with enhanced performance characteristics for military applications is driving the electronics industry toward the use of best-of-breed materials and device technologies. Threedimensional (3-D) integration provides a way to build complex microsystems through bonding and interconnection of individually optimized device layers without compromising system performance and fabrication yield. Bonding of device layers can be achieved through polymer bonding or metal-metal interconnect bonding with a number of metalmetal systems. RTI has been investigating and characterizing Cu-Cu and CulSn-Cu processes for high density area array imaging applications, demonstrating high yield bonding between sub-I5 11m …
On The Thermal Activation Of Negative Bias Temperature Instability, Richard G. Southwick Iii, William B. Knowlton, Ben Kaczer, Tibor Grasser
On The Thermal Activation Of Negative Bias Temperature Instability, Richard G. Southwick Iii, William B. Knowlton, Ben Kaczer, Tibor Grasser
Materials Science and Engineering Faculty Publications and Presentations
The temperature dependence of negative bias temperature instability (NBTI) is investigated on 2.0nm SiO2 devices from temperatures ranging from 300K down to 6K with a measurement window of ~12ms to 100s. Results indicate that classic NBTI degradation is observed down to ~200K and rarely observed at temperatures below 140K in the experimental window. Since experimental results show the charge trapping component contributing to NBTI is thermally activated, the results cannot be explained with the conventionally employed elastic tunneling theory. A new mechanism is observed at temperatures below 200K where device performance during stress conditions improves rather than degrades with …