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Bgaas Alloy Semiconductors For Lasers On Silicon, Joshua Mcarthur
Bgaas Alloy Semiconductors For Lasers On Silicon, Joshua Mcarthur
Mechanical Engineering Undergraduate Honors Theses
In the world of semiconductors today, there is a large dissonance between optical devices and electrical application. Due to the limitations of electron transport, photonic integrated circuits are soon-to-be vital in fields like telecommunications and sensing. Right now, these PIC’s are mostly made from indium phosphide. Due to its ubiquitous nature, however, there is a huge push to integrate efficient optics with silicon. It’s cheap, abundant, dope-able, and our electronic infrastructure is based on it. The reason why silicon photonics aren’t already commercialized is because of silicon’s indirect bandgap—it is inefficient with optical applications. The problem with combining direct gap …
Optimization Of Graphene Parameters For The Development Of Supercapacitors, Jessica L. Montgomery
Optimization Of Graphene Parameters For The Development Of Supercapacitors, Jessica L. Montgomery
Mechanical Engineering Undergraduate Honors Theses
In the growing market of evolving electronic devices and the sustainable goals of the energy industry, better sources of energy dense storage devices are needed. Carbon based supercapacitors have attracted the attention of research due to the natural properties of high electrical conductivity, chemical and electrochemical stability, and high surface area. The object of this thesis is to expand upon current knowledge of reduced graphene oxide to better understand the effectiveness of the material as electrode in supercapacitors. This thesis will focus on the physical orientation of supercapacitors to further develop a device that will allow a set of supercapacitors …
Chip-Package Interfacial Stress Analysis And Reliability Implications For Flip-Chip Power Devices, Jonathan Gh Treco
Chip-Package Interfacial Stress Analysis And Reliability Implications For Flip-Chip Power Devices, Jonathan Gh Treco
Mechanical Engineering Undergraduate Honors Theses
The solder in flip-chip assemblies experience high stress and strain because of thermal mismatch induced deformation. These deformations occur because of the differences of coefficient of thermal expansion between flip-chip assembly materials. The similarly in stress profiles between thermal induced and shear induced stress in solder joints enable the use of die shear testing as a representative technique for relating the max stress the flip-chip can withstand to cyclic thermal fatigue failures. In this work, two electronic device sample preparation types are evaluated: One set of samples are soldered together and other set of samples use epoxy as an adhesive. …
System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda
System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda
Mechanical Engineering Undergraduate Honors Theses
Electronic flip chip assemblies consist of dissimilar component materials, which exhibit different CTE. Under thermal cyclic operating conditions, this CTE mismatch produces interfacial and interconnect stresses, which are highly dependent on system layout. In this paper, sensitivity analyses are performed using ANSYS FEA to establish how the proximity and arrangement of neighboring devices affect interconnect stress. Flip chip alignment modes ranging from edge-to-edge to corner-to-corner are studied. Results of these FEA studies, demonstrated that closely packing devices together has the effect of making them act as one. This results in a significant increase in the thermomechanical stresses induced on peripheral …