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USF Tampa Graduate Theses and Dissertations

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Microfabrication

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Full-Text Articles in Engineering

Design And Implementation Of Solid/Solid Phononic Crystal Structures In Lateral Extensional Thin-Film Piezoelectric On Silicon Micromechanical Resonators, Abdulrahman Alsolami Nov 2020

Design And Implementation Of Solid/Solid Phononic Crystal Structures In Lateral Extensional Thin-Film Piezoelectric On Silicon Micromechanical Resonators, Abdulrahman Alsolami

USF Tampa Graduate Theses and Dissertations

Achieving high quality factor in MEMS resonator devices is a critical demand for today’s wireless communication and sensing technologies. In order to reach this goal, several dedicated prior works have been conducted based on published literature at different frequency ranges. Particularly, piezoelectrically transduced resonators, which are widely deployed in commercial wireless communication systems, could benefit from greatly improved qualify factor. So far, their development has evolved from thin film bulk acoustic resonators (FBAR’s) using surface attached piezoelectric thin-film transducers with moderate Q factors to high Q resonators equipped with a side-supporting tether (anchor) attached vibrating resonators that allow the devices …


Development Of 3-D Printed Hybrid Packaging For Gaas-Mems Oscillators Based On Piezoelectrically-Transduced Zno-On-Soi Micromechanical Resonators, Di Lan Jun 2018

Development Of 3-D Printed Hybrid Packaging For Gaas-Mems Oscillators Based On Piezoelectrically-Transduced Zno-On-Soi Micromechanical Resonators, Di Lan

USF Tampa Graduate Theses and Dissertations

Prior research focused on CMOS-MEMS integrated oscillator has been done using various foundry compatible integration techniques. In order to compensate the integration compatibility, MEMS resonators built on standard CMOS foundry process could not take full advantage of highest achievable quality factor on chip. System-in-package (SiP) and system-on-chip (SoC) is becoming the next generation of electronic packaging due to the need of multi-functional devices and multi-sensor systems, thus wafer level hybrid integration becomes the key to enable the full assembly of dissimilar devices. In this way, every active circuit and passive component can be individually optimized, so do the MEMS resonators …


Development Mems Acoustic Emission Sensors, Adrian Enrique Avila Gomez Nov 2017

Development Mems Acoustic Emission Sensors, Adrian Enrique Avila Gomez

USF Tampa Graduate Theses and Dissertations

The purpose of this research is to develop MEMS based acoustic emission sensors for structural health monitoring. Acoustic emission (AE) is a well-established nondestructive testing technique that is typically used to monitor for fatigue cracks in structures, leaks in pressurized systems, damages in composite materials or impacts. This technology can offer a precise evaluation of structural conditions and allow identification of imminent failures or minor failures that can be addressed by planned maintenances routines. AE causes a burst of ultrasonic energy that is measured as high frequency surface vibrations (30 kHz to 1 MHz) generated by transient elastic waves that …