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Material And Topographically Optimized Thermal Dissipation For High-Performance Electronic Devices Utilizing Vapor Chambers, Derek Joseph Daniels

USF Tampa Graduate Theses and Dissertations

Advances in materials science and engineering in the field of thermal transport and dissipation enable the use of higher-performance electronic devices that are smaller and generate more heat. Phase change thermal transport systems such as heat pipes and vapor chambers enable passive dissipation from devices that generate excessive heat without the need for actively pumped cooling systems. Properly designed vapor chamber enabled systems easily exceed the thermal conductivity of manufactured diamond at a small fraction of the cost.[1][2][3] While heat pipe phase change systems are generally one-dimensional with a limited cross section, vapor chambers are generally two-dimensional with a small …