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Physical Sciences and Mathematics Commons

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Physical Chemistry

Journal

2022

Cobalt interconnects

Articles 1 - 2 of 2

Full-Text Articles in Physical Sciences and Mathematics

Research Progress In Electroless Cobalt Plating And The Bottom-Up Filling Of Electroless Plating, Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang Jul 2022

Research Progress In Electroless Cobalt Plating And The Bottom-Up Filling Of Electroless Plating, Yu Shen, Bing-Bing Li, Yi Ma, Zeng-Lin Wang

Journal of Electrochemistry

With the continuous improvement of semiconductor integration, the resistivity of copper interconnect lines increases rapidly. When the width of the interconnect line is close to 7 nm, the resistivity of copper becomes the same as that of cobalt. International Business Machines Corporation (IBM) and Advanced Semiconductor Incorporation (ASI) have used cobalt to replace copper as a next-generation interconnect material. However, the fabrication of the cobalt seed layer and the super filling of electroplating cobalt for the 7 nm via-holes have been still the large challenge. Electroless plating is a very simple method to form a seed layer on the surface …


An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry, Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang Jun 2022

An Investigation On The Interface Corrosion Behaviors Of Cobalt Interconnects In Chemical Mechanical Polishing Slurry, Kai-Xuan Qin, Peng-Fei Chang, Yu-Lin Huang, Ming Li, Tao Hang

Journal of Electrochemistry

Cobalt is widely regarded as the most promising interconnect material for 10 nm node and beyond. The development of a chemical mechanical planarization (CMP) slurry suitable for cobalt interconnect is a critical component for the application of cobalt interconnect. During CMP process of the interconnect layer, the achievement of high-quality surface after planarization is greatly challenged by the metal corrosion in CMP slurry. In this contribution, the corrosion behavior of cobalt in a slurry with potassium persulfate (KPS) as an oxidizer, glycine as a complexing agent, and benzotriazole (BTA) as an inhibitor was investigated. Static erosion rates (SER) of cobalt …