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Full-Text Articles in Physical Sciences and Mathematics
Computational Studies Of Thermal Properties And Desalination Performance Of Low-Dimensional Materials, Yang Hong
Department of Chemistry: Dissertations, Theses, and Student Research
During the last 30 years, microelectronic devices have been continuously designed and developed with smaller size and yet more functionalities. Today, hundreds of millions of transistors and complementary metal-oxide-semiconductor cells can be designed and integrated on a single microchip through 3D packaging and chip stacking technology. A large amount of heat will be generated in a limited space during the operation of microchips. Moreover, there is a high possibility of hot spots due to non-uniform integrated circuit design patterns as some core parts of a microchip work harder than other memory parts. This issue becomes acute as stacked microchips get …
Reliability Analysis For Systems With Outsourced Components, Zhengwei Hu
Reliability Analysis For Systems With Outsourced Components, Zhengwei Hu
Doctoral Dissertations
"The current business model for many industrial firms is to function as system integrators, depending on numerous outsourced components from outside component suppliers. This practice has resulted in tremendous cost savings; it makes system reliability analysis, however, more challenging due to the limited component information available to system designers. The component information is often proprietary to component suppliers. Motivated by the need of system reliability prediction with outsourced components, this work aims to explore feasible ways to accurately predict the system reliability during the system design stage. Four methods are proposed. The first method reconstructs component reliability functions using limited …