Physical Sciences and Mathematics Commons^™

The Study Of Corrosion On Additive-Manufactured Metals., Braydan Daniels

Electronic Theses and Dissertations

The purpose of this study was to investigate and compare the corrosion mechanisms between wrought and additive-manufactured (3D-printed) copper and stainless steel. The experimental procedure consisted of measuring the open circuit potential, electrochemical impedance spectroscopy, linear sweep voltammetry, Tafel analysis, surface topology, and scanning electron microscopy for each metal within salt water, tap water, sulfuric acid, and synthetic body fluid (excluding copper in synthetic body fluid).

Overall, printed stainless steel was more corrosion-resistant than wrought stainless steel in tap water and synthetic body fluid based on OCP, LSV, and surface topology results. Additionally, printed copper was more corrosion-resistant than wrought …

Use Of Electrochemical Techniques And Statistical Analysis To Investigate The Pitting Probability Of Copper, Sina Matin

Electronic Thesis and Dissertation Repository

The development of a safe permanent disposal plan is essential for the long-term disposal of used fuel bundles. Nuclear Waste Management Organization (NWMO) has been investigating the deep geologic disposal of nuclear waste which offers the optimum passive safety system with a negligible probability of release of radionuclides into the environment.

The proposed used fuel containers (UFC) for the permanent disposal of high-level nuclear waste in Canada is comprised of a carbon steel vessel coated with a 3 mm corrosion-resistant copper layer deposited using a combination of electrodeposition and cold spray deposition. Although copper is often considered to be thermodynamically …

Electrodeposited Epitaxial Cobalt Oxides And Copper Metal, Caleb M. Hull

Doctoral Dissertations

"Electrochemical deposition methods are presented for the deposition of Co(OH)₂ and Cu metal. Paper I shows the deposition of β-Co(OH)₂ on Ti through electrochemical reduction of [Co(en)₃]³⁺ to [Co(en)₃]²⁺ in 2M NaOH. The catalytic properties of the deposited Co(OH)₂ towards water oxidation is found comparable to Co₃O₄, with the surface of the Co(OH)₂ converting to CoOOH during the reaction. Paper II gives the conditions suitable for epitaxial growth of Co(OH)₂ on Au(100), Au(110), and Au(111) following the same reduction mechanism as described in Paper I. …

Homo- And Heterometallic Bis(Pentafluorobenzoyl)Methanide Complexes Of Copper(Ii) And Cobalt(Ii), Janell Crowder

Legacy Theses & Dissertations (2009 - 2024)

β-Diketones are well known to form metal complexes with practically every known metal and metalloid. Metal complexes of fluorinated β-diketones generally exhibit increased volatility and thermal stability compared to the non-fluorinated analogues, and thus are used extensively in various chemical vapor deposition (CVD) processes for the deposition of metal, simple or mixed metal oxides, and fluorine-doped metal oxide thin films. Furthermore, the electron-withdrawing nature of the fluorinated ligand enhances the Lewis acidity of a coordinatively unsaturated metal center which facilitates additional coordination reactions. The physical and structural properties of fluorinated β-diketonate complexes are discussed in Chapter 1 …

Investigation On Laser Induced Deposition Of Cu-Based Materials At [Bmim]Bf4/Pt Electrode Interface, Min-Min Xu, Jin-Hua Mei, Jian-Lin Yao, Ren-Ao Gu

Journal of Electrochemistry

By controlling the negative potential, Cu-based materials were deposited at the [BMIm]BF₄/Pt electrode interface under the laser irradiation. The effects of laser power and irradiation time on the yield of deposition products were studied by using different laser powers and different irradiation time. The product yield could be directly determined by the size of deposition point through the observation from the optical microscope. Further mechanism study combined with the formula deduced that the thermal effect of the laser could make the electrode surface temperature rise 110 degrees, which can promote the occurrence of electrodeposition. By SEM characterization, the …

Doped Tio2 Nanowires For Applications In Dye Sensitized Solar Cells And Sacrifical Hydrogen Production, Qasem Alsharari

Electronic Thesis and Dissertation Repository

This thesis explores the synthesis of metal oxide 1-D nanowires using a sol-gel method in supercritical carbon dioxide (sc-CO₂), as an environmental friendly enabling solvent. Porous nanowires were synthesized and their performance was tested in dye sensitized solar cell and sacrifical hydrogen production. Titanium isopropoxide (TIP) was used as a precursor for titania synthesis while copper, bismuth and indium were examined as dopants, respectively. The sol-gel reactions were catalyzed by acetic acid in CO₂ at a temperature of 60 °C and pressure of 5000 psi. It was observed that acetic acid/monomer ratio > 4 produced nanowires while a …

Electrodeposition Of Copper From A Choline Chloride Based Ionic Liquid, Rostom Ali M., Ziaur Rahman Md., Sankarsaha S.

Journal of Electrochemistry

The electrodeposition of copper from a solution containing copper chloride in either an ethylene glycol (EG)-choline chloride based or a urea-choline chloride based ionic liquid has been carried out onto a steel cathode by constant current and constant potential methods at room temperature. The influences of various experimental conditions on electrodeposition and the morphology of the deposited layers have been investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). It is shown that very smooth, shiny and dense with good adherence and bright metallic coloured copper coatings can be obtained from both EG and urea based ionic liquids at …

Ruco To Extend The Scalability Of Ultra-Thin Direct Plate Liners, Daniel Verne Greenslit

Legacy Theses & Dissertations (2009 - 2024)

In traditional semiconductor technology a sputtered copper seed layer is used to improve the adhesion, microstucture, and electromigration characteristics of electrochemically deposited (ECD) copper. The seed layer is deposited on top of a Ta/TaN stack. The Ta layer acts as an adhesion and nucleation layer for the copper seed and the TaN serves as a diffusion barrier for the Cu. As the line widths continue to shrink, scaling each of these layers becomes more difficult. It would be advantageous for the interconnect to be composed of as much copper as possible, transitioning from the traditional liner seed stack to a …

Nucleation, Wetting And Agglomeration Of Copper And Copper-Alloy Thin Films On Metal Liner Surfaces, Stephanie Florence Labarbera

Legacy Theses & Dissertations (2009 - 2024)

One of the key challenges in fabricating narrower and higher aspect ratio interconnects using damascene technology has been achieving an ultra-thin (~2 nm) and continuous Cu seed coverage on trench sidewalls. The thin seed is prone to agglomeration because of poor Cu wetting on the Ta liner. Using in-situ conductance measurements, the effect of lowering the substrate temperature during Cu seed deposition has been studied on tantalum (Ta) and ruthenium (Ru) liner surfaces. On a Ta surface, it was found that lowering the deposition temperature to -65°C increases the nucleation rate of the Cu thin film, and reduces the minimum …

Electronic And Structural Properties Of Molybdenum Thin Films As Determined By Real Time Spectroscopic Ellipsometry, J. D. Walker, H. Khatri, V. Ranjan, Jian Li, R. W. Collins, S. Marsillac

Electrical & Computer Engineering Faculty Publications

Walker, J.D., Khatri, H., Ranjan, V., Li, J., Collins, R.W., & Marsillac, S. (2009). Electronic and structural properties of molybdenum thin films as determined by real-time spectroscopic ellipsometry. Applied Physics Letters, 94(14). doi: 10.1063/1.3117222

Energy Pathways And Directionality In Deformation Twinning, S. Kibey, J. B. Liu, Duane D. Johnson, H. Sehitoglu

Duane D. Johnson

We present ab initiodensity functional theory calculations of twinning energy pathways for two opposite twinning modes, (111)[112¯] and (111)[1¯1¯2], in fcc materials to examine the directional nature of twinning which cannot be explained by classical twin nucleationmodels or the “twinnability” criterion. By accounting for these energy pathways in a multiscale model, we quantitatively predict the critical twinning stress for the (111)[1¯1¯2] mode to be substantially higher compared to the favorable (111)[112¯] mode (whose predicted stresses are in agreement with experiment), thus, ruling out twinning in the (111)[1¯1¯2] mode.

Effects Of Sulfide Ions On The Inhibiting Efficiency Of Eda As A Copper Corrosion Inhibitor In Dilute Hcl Solution, Wen-Juan Qu, Rong-Gui Du

Journal of Electrochemistry

The anticorrosion action of EDA on copper in dilute HCl solution and the effect of sulfide ions on the inhibiting efficiency were studied by the Tafel plot method.The corrosion potential of Cu shifted to more positive value and the corrosion current density decreased after the addition of Na_(2)S to the solution.The results indicated that sulphide ions could increase the inhibiting efficiency of EDA because of the synergistic inhibition effect between EDA and Na_2S,resulting from the adsorption of HS~(-)on the surface of Cu,facilitated the adsorption of EDA to form a highly protective adsorbed layer which prevented Cu from corrosion.

Generalized Planar Fault Energies And Twinning In Cu–Al Alloys, S. Kibey, J. B. Liu, Duane D. Johnson, H. Sehitoglu

Duane D. Johnson

We report ab initio density functional theory calculations of generalized planar fault energies of fcc Cu–xAl (x=0, 5.0, and 8.3at.%) alloys. We investigate the effects of substitutional solute Al on the unstable intrinsic γus and twin γutstacking faultenergies (SFEs). Our results reveal an increased tendency of Cu–Al to deform preferentially by twinning with increasing Al content, consistent with experiment. We attribute this mechanical behavior to appreciable lowering of the twinning barrier γut, along with the stable intrinsic and twin SFEs.

Copper Electrodeposition Under The Perturbation Of Hard Particles, Zeng-Wei Zhu, Di Zhu

Journal of Electrochemistry

Copper electrodepositon was carried out on the rotating cathode,with hard particles(such as ceramic beads) filling between the electrodes.The rotation of cathode led hard particles to polish and impact the surface of deposit during electrodeposition.Copper deposits with a mass of cuspidal nodules were produced in acid sulfate solutions while brittle deposits without nodules were produced in alkaline sulfate solutions.It was also found that brightening and smoothing deposit could be obtained from the alkaline solution,and the deposit was approximatively disordered orientation with granular morphology of about 100~300 nm.The results show that the polishing and impact of hard particles can effectively disturb the …

Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun

Journal of Electrochemistry

Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu~(2+ )on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu~(2+)resulted in a void free filling of the trenches.

Effect Of Dissolved Oxygen On The Corrosion Behavior Of Coalesced Copper And Stainless Steel-206 In Acetic Solutions, Rong-Zong Hu, Xiong-Cao Zhao, Yu-Hua Weng, Chang-Jian Lin

Journal of Electrochemistry

Linear sweeping technique and dissolving oxygen sensor were used to study the effect of dissolved oxygen and relating factors on the corrosion behavior of coalesced copper and stainless steel-206 in acetic solutions. It was found: 1. The existing of dissolved oxygen is one of the important factors, which strongly influenced the corrosion behavior of coalesced copper and stainless steel-206 in acetic solution. 2. The existing of dissolved oxygen is benefitial to the preventing stainless steel-206 from corrosion in acetic solutions, but damage to the preventing coalesced copper from corrosion. 3. At the high temperature since the dissolved oxygen was escaping …

Determination Of Copper In The Waste Water Of Plating By Chronocoulometry For Flowing Solution, Xin-Hua Lin, Wei Chen

Journal of Electrochemistry

The chronocoulometry for flowing solution was devoloped and applied to the detemination of copper(Ⅱ) in the waste water of plating.The linear range of copper(Ⅱ) was 2～16mg/L,and the relative standard deviation was less than 0.1% ( n =8).The recovery was 98%～103% for copper(Ⅱ) in the waste water.Chronocoulometry for flowing solution overcomed noise disturbance resulting from capacity current and variety of property of electrode surface.This method was sensitive,accurate and well reproducible.

High-Efficiency Solar Cells Based On Cu(Inal)Se[Sub 2] Thin Films, S. Marsillac, P. D. Paulson, M. W. Haimbodi, R. W. Birkmire, W. N. Shafarman

Electrical & Computer Engineering Faculty Publications

A Cu(InAl)Se₂solar cell with 16.9% efficiency is demonstrated using a Cu(InAl)Se₂thin film deposited by four-source elemental evaporation and a device structure of glass/Mo/Cu(InAl)Se₂/CdS/ZnO/indium tin oxide/(Ni/Algrid)/MgF₂. A key to high efficiency is improved adhesion between the Cu(InAl)Se₂ and the Mo back contact layer, provided by a 5-nm-thick Ga interlayer, which enabled the Cu(InAl)Se₂ to be deposited at a 530 °C substrate temperature. Film and device properties are compared to Cu(InGa)Se₂ with the same band gap of 1.16 eV. The solar cells have similar behavior, with performance limited by recombination through …

Segregation Of Bismuth To Triple Junctions In Copper, K.-M. Yin, Alexander H. King, T.E. Hsieh, F.-R. Chen, J.J. Kai, L. Chang

Alexander H. King

Bismuth segregation in copper has been studied using energy-dispersive X-ray spectrometry (EDX) in a JEOL 2010F transmission electron microscope. In addition to the expected solute enrichment at grain boundaries, we have observed extremely high concentrations of bismuth at certain triple junctions, with significantly greater enrichment factors than in the adjacent grain boundaries. It is shown here that the triple junction segregation is a function of the parameters of the grain boundaries at the triple line, and existence of this type of segregation implies that the affected triple junctions embody excess free energy. At least one of the observed triple junctions …

Behavior Of Copper In Hydrogen Storage Alloy Microencapsulated By Copper, Dawei Zhang, Huatang Yuan, Huabin Yang, Zuoxiang Zhou, Yunshi Zhang

Journal of Electrochemistry

Negative electrode made from Cu microencapsulated hydrogen storage alloy was studied by using cyclic voltammetry method. The results showed that copper as a coating material was of a certain stability in 5 mol/L KOH solution within the range of charge and discharge voltage. But when expanding the sweep voltage, the CV curve showed a pair of distinct oxidation reduction current peaks of Cu 2O formation at E =-0.3 V and Cu 2O reduction at E =-0.6 V. With charging discharging cycles, copper is liable to be oxidized to Cu 2O and further oxidized into CuO 2- 2. When charged again, …

Electrochemical Studies On Chemical Polishing Of Copper, Keping Han, Jingli Fang

Journal of Electrochemistry

Changes in specular reflectivity,weight loss,surface topograph and potential with time and current-potential curves during chemical polishing were determined.The results showed that chemical polishing was composed of the etching,polishing and pitting stage.The passivating film theory also applied to the chemical polishing.

Electrochemical Study Of The Corrosion Behavior Of Coalesced Copper And Sw-206 Stainless Steel In The Acetic-Acid Solution, Rongzong Hu, Changjian Lin, Jianguang Tan

Journal of Electrochemistry

In order to provide a theoretic and experimental consideration for the material selection and anit-corrosion in the petrochemical industries the corrosion behavior of coalesced copper and sw-206 stainless steel in the acetic acid solution was studied by electrochemical impedance spectroscopy and polarization techniques. The effects of the temperature,acetic acid concentration and solubilized oxygen in the acetic acid solution on the corrosion process of this two metals were analyzed. It was found that these effects obviously accelerate corrosion process for the coalesced copper,but no apparent influnce for the sw-206 stainless steel.In the the acetic acid solution,containing water and oxygen were beneficial …

Cyclic Voltammetric Calorimetry Studying The Deposition Of Copper Of Pt Electrodes, Yongchun Zhu, Robin H J Clark

Journal of Electrochemistry

In the present paper,cyclic voltammetric calorimetry has been used to study thedeposition of copper on platinum electrode from LiClO_4 aqueous solution. Cyclic voltammetricthermogram and cyclic voltammetric differential thermogram show that the deposition of copper on theelectrode is an exothermal process with a strong interaction between copper and platinum layer(-3227.0 kJ /mol).The electrochemical oxidation of the deposited copper is composed of twoprocesses :an endothermal activation process with 747.0 kJ/mol of activation enthalpy,and anexothermal oxidation reaction with-189.9 kJ/mol of the reaction enthalpy, which are accord withthe data from the theoritical estimation and thermodynamic handbook respectively.

Electrochemically Modified Glassy Carbon Electrode And Determination Of Copper By Anodic Stripping Voltammetry, Jinrui Xu, Yie Liu, Xiurun Zhuang

Journal of Electrochemistry

This paper reported the glassy carbon electrode modified by cyclic voltammetrybetween-0. 1and + 1. 5 V(vs. SCE)in an aqueous solution containing catechol,formaldehyde andtalium hydroxide. The modified electrode can be applied to the determination of copper(Ⅱ) in water,and its sensitivity is about 35 times higher than that of unmedified glassy carbon electrede, Thequantitative limit with this modified electrede is 0. 1 ng/ml.

Compensation And Characterization Of Gallium Arsenide, Randy A. Roush

Electrical & Computer Engineering Theses & Dissertations

The properties of transition metals in gallium arsenide have been previously investigated extensively with respect to activation energies, but little effort has been made to correlate processing parameters with electronic characteristics. Diffusion of copper in gallium arsenide is of technological importance due to the development of GaAs:Cu bistable photoconductive devices. Several techniques are demonstrated in this work to develop and characterize compensated gallium arsenide wafers. The material is created by the thermal diffusion of copper into silicon-doped GaAs. Transition metals generally form deep and shallow acceptors in GaAs, and therefore compensation is possible by material processing such that the shallow …

Influence Of Copper Doping On The Performance Of Optically Controlled Gaas Switches, St. T. Ko, V. K. Lakdawala, K. H. Schoenbach, M. S. Mazzola

Electrical & Computer Engineering Faculty Publications

The influence of the copper concentration in silicon-doped gallium arsenide on the photoionization and photoquenching of charge carriers was studied both experimentally and theoretically. The studies indicate that the compensation ratio (N_Cu/N_Si) is an important parameter for the GaAs:Si:Cu switch systems with regard to the turn-on and turn-off performance. The optimum copper concentration for the use of GaAs:Si:Cu as an optically controlled closing and opening switch is determined.

An Optically Controlled Closing And Opening Semiconductor Switch, K. H. Schoenbach, V. K. Lakdawala, R. Germer, S. T. Ko

Electrical & Computer Engineering Faculty Publications

A concept for a bulk semiconductor switch is presented, where the conductivity is increased and reduced, respectively, through illumination with light of different wavelengths. The increase in conductivity is accomplished by electron ionization from deep centers and generation of bound holes. The reduction of conductivity is obtained by hole ionization from the excited centers and subsequent recombination of free electrons and holes. The transient behavior of electron and hole density in a high power semiconductor (GaAs:Cu) switch is computed by means of a rate equation model. Changes in conductivity by five orders of magnitude can be obtained.

Effect Of Recovery On The Recrystallized Grain-Size Of High Purity Aluminum, Rodney L. Helterline

Bachelors Theses and Reports, 1928 - 1970

When a cold-worked metal is annealed, it’s physical properties hange as a result of a new grain structure. The annealing treatment is divided into three stages according to the changes that occur in the distorted metal: (1) recovery, (2) recrystallization, and (3) grain growth.

The Application Of Electric Energy To The Metallurgy Plants In Montana, Edwin J. Duncan

Bachelors Theses and Reports, 1928 - 1970

Since the year 1800, metallurgy has been affiliated with electricity. In fact, the two industries have grown side by side, being naturally dependent upon each other and having a parallel growth.

The Construction And Operation Of A Universal Specimen Mount With Protective Lead Shield For The Purpose Of Determining Pole Figures Using The Schulz-Decker Transmission Technique, Richard L. Fausner

Bachelors Theses and Reports, 1928 - 1970

It was the purpose of this study to construct a universal mount, to construct a protective lead shield, to operate the instrument, and to provide a pole figure using the transmission method of Schulz and Decker. There are at present several lengthy x-ray methods of determining the grain orientation of metals. These methods are mainly photographic. In order to provide a rapid means of obtaining the necessary information concerning the grain orientation of a metal, a universal mount was constructed.