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Full-Text Articles in Physical Sciences and Mathematics
Electrical Modeling For Dynamic Performance Prediction And Optimization Of Mcpms Layout, Quang Minh Le
Electrical Modeling For Dynamic Performance Prediction And Optimization Of Mcpms Layout, Quang Minh Le
Graduate Theses and Dissertations
In recent years, the fast development of Multichip Power Modules (MCPM) packaging and Wide Bandgap (WBG) technology has enabled higher voltage and current ratings, better thermal performance, lower parasitic parameters, and higher mechanical reliability. However, the design of the MCPM layout is a multidisciplinary problem leading to many time-consuming analyses and tedious design processes. Because of these challenges, the design automation tool for MCPM layout has become an emerging research area and gained much attention from the power electronics community. The two critical objectives of a design automation tool for MCPM layout are fast and accurate models for design insights …
Constraint-Aware, Scalable, And Efficient Algorithms For Multi-Chip Power Module Layout Optimization, Imam Al Razi
Constraint-Aware, Scalable, And Efficient Algorithms For Multi-Chip Power Module Layout Optimization, Imam Al Razi
Graduate Theses and Dissertations
Moving towards an electrified world requires ultra high-density power converters. Electric vehicles, electrified aerospace, data centers, etc. are just a few fields among wide application areas of power electronic systems, where high-density power converters are essential. As a critical part of these power converters, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New packaging technologies are also introduced to produce reliable and efficient multichip power module (MCPM) designs to push the current limits. The complexity of the emerging MCPM …