Physical Sciences and Mathematics Commons^™

Analysis Of The Mechanical Properties Of Dgebf/4,4’-Dds Thermoset Systems As A Function Of Cure Rate, Chase B. Thompson

Honors Theses

The relationship between macroscopic mechanical and thermal properties and ramp rate during cure of epoxy-amine systems consisting of the epoxide resin digylcidyl ether of bisphenol F (DGEBF, provided Hexion specialty chemicals) and 4,4-diaminodiphenyl sulfone (4,4-DDS, provided by Atul Sulpho) were probed using Dynamic Mechanical Analysis (DMA), Positron Annihilation Lifetime Spectroscopy (PALS), and compression testing. These systems were cured in a programmable oven; the samples were heated from 35°C to 180°C at ramp rates of 0.5, 1.0, 1.5, 2.0, 2.5, 5.0, 10, and 15°C/min. Even as the ramp rates during the cure of these materials was changed, there was very little …