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Relationships Between Cure Kinetics, Network Architecture, And Fluid Sensitivity In Glassy Epoxies, Katherine Lea Frank
Relationships Between Cure Kinetics, Network Architecture, And Fluid Sensitivity In Glassy Epoxies, Katherine Lea Frank
Dissertations
Relationships between chemical structure, cure kinetics, network morphology and free volume have been correlated with fluid ingress for glassy epoxy network blends. Polymers synthesized from diglycidyl ether of bisphenol-A (DGEBA) and diglycidyl ether of bisphenol-F (DGEBF) were blended with varying amounts of triglycidyl-m-aminophenol (TGAP), tetraglycidyl-4,4-diaminodiphenylmethane (TGMP), napthylamine (NA), adamantylamine (AA), and aminopropylisobutyl polyhedral oliogmericsilsesquioxane (AI-POSS) and cured with 3,3’- and 4,4’- diaminodiphenylsulfone (DDS) to control fractional free volume, average hole size and morphology.
Varying curing profiles introduced morphological changes resulting in differences in network architectures. Epoxy with 10% NA had a smaller Vh (71 Å3) …