Engineering Commons^™

Enhanced Heat Transfer In Spray Cooling Through Surface Modifications: An Experimental And Computational Study, Azzam Saadi Salman

Theses and Dissertations

Today, dissipating high heat flux safely is one of the greatest challenges for thermal engineers in thermal management systems, and it becomes a critical barrier to technological developments for many engineering applications. Due to technological advances and aggressive micro-miniaturization of electronic components, the surface area of most devices has shrunk while the computational power increased exponentially. Therefore, the amount of heat dissipated from surfaces has increased significantly. Numerous cooling techniques have been introduced to replace the traditional air cooling systems and to maintain the efficiency and reliability of electronic components. Microelectronics work efficiently and safely at surface temperatures of < 100 ℃ and 125 ℃ for general and defense applications, respectively. One of the proposed alternative schemes is spray cooling, which is considered one of the most advanced cooling methods. It is used for high and ultra-high heat flux dissipation, as it can dissipate 150-200 W/cm2 while maintaining the surface temperature within this range. Also, spray cooling removes a large amount of energy at a lower liquid flow rate compared to other cooling techniques, such as jet impingement and microchannel heat sink. The thermal performance of spray cooling systems can be enhanced either actively or passively. Active enhancement is a very efficient technique; however, it adds more pumping power. The present work focuses on three main objectives: evaluating and analyzing spray cooling performance, developing a three-dimensional numerical multi-phase model for heat transfer process in spray cooling and enhancing the thermal performance of spray cooling passively.

First, …

Development Of Scalable And Tunable Super- Hydrophilic And - Hydrophobic Coatings On The Cu Substrate For Phase Change Heat Transfer Applications, Raikan Saad Dawas

Theses and Dissertations

The aim of this study is to enhance and sustain the thin liquid film evaporation (TLFE) as well as dropwise condensation (DWC) on scalable copper substrates. The current dissertation consists of two sections. The objective of the first section is to enhance the dry cooling technology which is widely used in industrial applications such as in the air side of power plants, AC unit, or electronic cooling. However, the thermal dissipation performance is limited with low heat transfer coefficients (HTCs) due to the low thermal conductivity and density of the air. Inspired by the phase change heat transfer during the …