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Full-Text Articles in Engineering
Development Of Palladium Nanowires, Chuanding Cheng
Development Of Palladium Nanowires, Chuanding Cheng
Doctoral Dissertations
Inherent limitations of traditional lithography have prompted the search for means of achieving self-assembly of nano-scale structures and networks for the next generation of electronic and photonic devices. The nanowire, the basic building block of a nanocircuit, has recently become the focus of intense research. Reports on nanowire synthesis and assembly have appeared in the scientific literature, which include Vapor-Liquid-Solid mechanism, template-based electrochemical fabrication, solvothermal or wet chemistry, and assembly by fluid alignment or microchannel networks. An ideal approach for practical application of nanowires would circumvent technical and economic constraints of templating. Here we report on the self-assembly of highly-ordered …
Chemical Vapor Deposition Of Thin Films For Ulsi Interconnect Metallization, Lidong Wang
Chemical Vapor Deposition Of Thin Films For Ulsi Interconnect Metallization, Lidong Wang
LSU Doctoral Dissertations
We have studied the kinetics of copper chemical vapor deposition (CVD) for interconnect metallization using solution delivery of Cu(hfac)2 (Cu(II) hexafluoroacetyl-acetonate) dissolved in isopropanol. We observe a growth rate of 17.7 „b 1.5 nm/min at reference conditions of 300„aC substrate temperature, 0.025 Torr Cu(hfac)2 partial pressure, 1.6 Torr isopropanol (reducing agent), and 80 Torr H2 (carrier gas). The film resistivity approaches the bulk value of copper for film thickness greater than 100 nm. Reaction order experiments show first-order kinetics with respect to Cu(hfac)2 partial pressure and zero-order with respect to isopropanol. A series reaction mechanism including three kinetically significant steps …