Engineering Commons^™

Raman Thermometry Of Graphene Based Thermal Materials, Pengcheng Xu

Electrical Engineering Theses and Dissertations

With the growing demand for high performance computing, we are pushing for higher performance integrated circuits at an ever faster rate. Recent advances in semiconductor production technology sees transistors with a 5 nm process devices being produced for consumer use. This enabled engineers to pack tens of billions of transistors in a package no larger than a fingernail. However, that brings up a problem that we have been long battling against. How can we get rid of the heat produced by these billions of transistors. The current electronic performance is bottle-necked by the ability of the package taking heat away …