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Full-Text Articles in Engineering
Quantitative Peel Test For Thin Films/Layers Based On A Coupled Parametric And Statistical Study, Maysam Rezaee, Li Chih Tsai, Muhammad Istiaque Haider, Armin Yazdi, Ehsan Sanatizadeh, Nathan P. Salowitz
Quantitative Peel Test For Thin Films/Layers Based On A Coupled Parametric And Statistical Study, Maysam Rezaee, Li Chih Tsai, Muhammad Istiaque Haider, Armin Yazdi, Ehsan Sanatizadeh, Nathan P. Salowitz
Mechanical Engineering Faculty Articles
The adhesion strength of thin films is critical to the durability of micro and nanofabricated devices. However, current testing methods are imprecise and do not produce quantitative results necessary for design specifications. The most common testing methods involve the manual application and removal of unspecified tape. This overcome many of the challenges of connecting to thin films to test their adhesion properties but different tapes, variation in manual application, and poorly controlled removal of tape can result in wide variation in resultant forces. Furthermore, the most common tests result in a qualitative ranking of film survival, not a measurement with …