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Articles 1 - 5 of 5
Full-Text Articles in Engineering
A Bulk Driven Transimpedance Cmos Amplifier For Sipm Based Detection, Shahram Hatefi Hesari
A Bulk Driven Transimpedance Cmos Amplifier For Sipm Based Detection, Shahram Hatefi Hesari
Masters Theses
The contribution of this work lies in the development of a bulk driven operational
transconducctance amplifier which can be integrated with other analog circuits and
photodetectors in the same chip for compactness, miniaturization and reducing the
power. Silicon photomultipliers, also known as SiPMs, when coupled with scintillator materials are used in many imaging applications including nuclear detection. This thesis discuss the design of a bulk-driven transimpedance amplifier suitable for detectors where the front end is a SiPM. The amplifier was design and fabricated in a standard standard CMOS process and is suitable for integration with CMOS based SiPMs and commercially …
Load Modeling And Evaluation Of Leds For Hardware Test Bed Application, Jillian M. Ruff
Load Modeling And Evaluation Of Leds For Hardware Test Bed Application, Jillian M. Ruff
Masters Theses
The lighting industry was revolutionized with the emergence of LED lighting. Over the last 15 years, LED lighting device sales and utilization have grown immensely. The growth and popularity of LEDs is due to improved operation of the device when compared to previous lighting technologies. Efficient performance of the device is critical due to the growth of global energy consumption.
As nonrenewable generation fuel is finite, utilities have begun the transition to renewable energy generation. Generation and distribution systems become inherently complex to comprehend and maintain with incorporation of emerging supply and load technologies. With the unprecedented growth of LED …
Development Of Arduino-Based Portable Systems For Electroanalytical Detection, Jiamei Huang
Development Of Arduino-Based Portable Systems For Electroanalytical Detection, Jiamei Huang
Masters Theses
This work presents the development of a multi-mode electroanalytical detection system based on Arduino microcontroller board. First, a multichannel impedance readout system is designed for alternating current electrokinetics (ACEK) based capacitive sensing. ACEK phenomena on 100μm interdigitated electrodes are observed via fluorescent particles as well as bioparticles, which illustrate the mechanisms of ACEK target enrichment for the capacitive sensing method. I2C multiplexer is applied to allow multiple impedance converters to work together providing continuous AC signals for ACEK capacitive sensing. Second, an electronic nose composed of three modules including a gas sensor array, a circuit for signal acquisition integrated with …
Design And Evaluation Of A Unique Weighted-Sum-Based Anger Camera, Matthew W. Seals
Design And Evaluation Of A Unique Weighted-Sum-Based Anger Camera, Matthew W. Seals
Masters Theses
Anger camera imaging technology has become widely popular for neutron diffraction imaging due to recent shortages in Helium-3 (He-3). Research into neutron diffraction optimized Anger camera by the Oak Ridge National Laboratory (ORNL) detectors group has provided an alternative to He-3 Tube-based detectors with a high-resolution Anger camera. However, the cost of these high-resolution Anger camera technology can make it less attractive than He-3 tubes when a large Field of View (FOV) is desired. Currently, there is a need for a lower-cost alternative to this high-resolution anger camera. Further applications for Anger camera have become of interest with the advent …
Planar Ultra-Wideband Modular Antenna (Puma) Arrays For High-Volume Manufacturing On Organic Laminates And Bga Interfaces, James R. Lacroix
Planar Ultra-Wideband Modular Antenna (Puma) Arrays For High-Volume Manufacturing On Organic Laminates And Bga Interfaces, James R. Lacroix
Masters Theses
This work proposes wideband and broadband Planar Ultra-wideband Modular Antenna (PUMA) arrays designed to improve cost and reliability for high production volume commercial and military applications. The designs feature simplified PCB stack-ups with high dielectric constant (Dk) dimensionally stable materials to improve the manufacturing cost and yield. Additionally, the packages use ball grid array (BGA) interconnects, commonly used in digital electronics, for simple solder reflow integration with radio frequency (RF) electronics. While high Dk materials present practical manufacturing benefits, theoretical background will show how and why PUMA arrays lose frequency bandwidth and scan volume with high Dk materials. Further, a …