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Journal of Electrochemistry

2005

Electroless deposition

Articles 1 - 2 of 2

Full-Text Articles in Engineering

The Mechanism Of Ethylenediamine On Electroless Ni-B Alloy Deposition, Sen-Lin Wang Nov 2005

The Mechanism Of Ethylenediamine On Electroless Ni-B Alloy Deposition, Sen-Lin Wang

Journal of Electrochemistry

The effects of ethylenediamine stabilizer on the deposition rate and on the stability of the plating bath for electroless deposition of Ni-B alloy were investigated.It was found that the addition of ethylenediamine greatly enhances the stability of the electroless plating bath.The electrochemical polarization including cathodic and anodic polarizations measurements were carried out to examine the effect of ethylenediamine on the deposition process.The results show that ethylenediamine affects both the cathodic and the anodic polarization processes.The oxidation current of the reducer and the reduction current of Ni-B alloy decrease greatly when ethylenediamine was added into the plating bath.The infrared spectroscopy(IR) experiments …


Ni-Mo-P Alloy By Electroless Deposition And Its Properties, Sen-Lin Wang May 2005

Ni-Mo-P Alloy By Electroless Deposition And Its Properties, Sen-Lin Wang

Journal of Electrochemistry

The electroless Ni-Mo-P alloy has been deposited from the alkaline bath containing boric acid as a buffer agent and sodium citrate as a complexing agent. The effect of deposition parameters, such as pH and concentration of (NH_(4))_(6)Mo_(7)O_(24)4H_(2)Oon the plating rate, the composition, the structure and the microhardness of the coating was examined. It was found that the presence of molybdenum has an inhibitory effect on the alloys deposition. As a consequence, the percentage of molybdenumin the Ni-Mo-P coatings never reaches high values, which was lower than 20 at%. It was also shown that the deposition condition affects the microhardness of …