Engineering Commons^™

Research On Color Matching Model For Color Qr Code, Fei You Dr., Qingli Zhang Dr., Bruce Welt Prof.

Journal of Applied Packaging Research

Objective To provide a faster and more effective way for consumers to obtain the additional information of product, the color quick response (QR) code is printed on product packaging. To improve decoding accuracy of color QR codes. This paper constructs a color matching model with good performance, which restrains aliasing between two color encoding modules of color QR code. Methods By comparing and analyzing the character of several typical color spaces, the HSV color space was chosen for its favorable attributes. Based on the enlarging capacity principle of color QR code and the maximum rule of relative Euclidean distance, 2 …

Application Of Active And Edible Films Of Sodium Caseinate To Extend The Shelf-Life Of Argentine Pategrás Cheese, Brenda S. Álvarez, Natalia Damiani, Marina Czerner, Josefa F. Martucci, Liesel B. Gende

Journal of Applied Packaging Research

Argentine Pategrás cheese is one of the most popular types of cheese in Argentina. The main spoilage causes in these products are microbiological contamination and lipid rancidity. Semi-hard cheeses are usually covered with a paraffin wax that favors its preservation. When pieces are stored, cutting faces must be protected to prevent desiccation and contamination. Active biodegradable films are an alternative to the traditional materials, in particular, casein-based edible films are attractive for food applications. In the present work, active films of sodium caseinate with oregano (Origanum vulgare) and laurel (Laurus nobilis) essential oils were produced for …

Evaluation Of Biodegradability Characteristics Of Cellulose-Based Film As Per Is/Iso 14855-1, Narayan C. Saha Dr, Gaurav Madhu Dr, Diksha B. Kadu Ms

Journal of Applied Packaging Research

Biodegradable polymers (especially those derived from plant sources) begin their lifecycle as renewable resources, usually in the form of starch or cellulose. In this paper, the evaluation of biodegradability of cellulose-based polymer film under controlled composting conditions as per the guidelines of IS/ISO 14855 (Part-1) standard has been described. Microcrystalline cellulose (MCC) powder was taken as positive-control polymer. The apparatus used to analyse the degree and rate of biodegradation was developed indigenously. The validation of the biodegradability testing apparatus was also performed as per the prescribed test method given in IS/ISO 14855-1.

The Influence Of Different Packaging Materials And Atmospheric Conditions On The Properties Of Pork Rinds, Kristi Kõrge, Katrin Laos

Journal of Applied Packaging Research

Rancidity development in high fat content products is a common off-flavor flaw in snack foods. Packaging is often used to avoid spoilage and extend shelf-life. The properties of pork rinds packaged in four different packaging materials with and without nitrogen were studied during 120 days of storage (22 °C, RH 60%, absence of light). The influence of different packaging materials and atmospheric conditions on pork rinds’ water activity, hardness, crispness and rancidity development was determined. The PET/PE packaging material had lower barrier properties for the product in both atmospheric conditions compared with PP/metPP (40 and 50 μm) and PET/PETmet/PE. PP/metPP …

Experimental And Theoretical Evaluation Of The Effect Of Panel Geometry On The Failure Of Corrugated Board Panel, Takashi Takayama, Katsuhiko Saito, Akira Higashiyama

Journal of Applied Packaging Research

McKee’s formula is widely used to predict the compression strength (CS) of corrugated boxes and panels. It can accurately estimate the compression strength of boxes that are within a practical size range, but recently, larger and smaller corrugated boxes than before have been extensively developed. Therefore, there is a need for a CS prediction formula that works beyond the application range of McKee’s formula. Recent researches consider the failure mode as a combination of collapsing and buckling failure and remove the constraints and the assumptions associated with McKee’s formula. This makes it possible to more accurately estimate the CS of …

A Method For Generating Random Vibration Using Acceleration Kurtosis And Velocity Kurtosis, Daichi Nakai, Katsuhiko Saito

Journal of Applied Packaging Research

Random vibration tests for packaging are conducted to confirm safety during shipping by truck. However, there is a difference between the traditional random vibration tests and the real vibrations on the truck bed. One reason for this difference is the shock caused by road roughness. Hence, many studies have been conducted to improve random vibration testing. In these studies, the root mean square, power spectral density, kurtosis, and probability density of acceleration are considered. In this study, we show that the kurtosis and probability density of velocity are also important factors for such tests and propose a new method for …

Permeability Of Oxygen And Carbon Dioxide Through Pinholes In Barrier Coatings, Petri Johansson, Johanna Lahti, Jorma Vihinen, Jurkka Kuusipalo

Journal of Applied Packaging Research

Abstract

Packaging materials are typically made of multilayer structures combining polymers, metals and inorganic materials. Multilayer structures are selected in order to optimize the thickness and performance in packaging applications. Atomic layer deposited (ALD) aluminium oxide (Al₂O₃) layer provides good barrier properties against oxygen and carbon dioxide gases i.e. permeation of gases through ALD coated polymer films will reduce remarkably. The target was to study the effect of pinholes on the oxygen and carbon dioxide permeability of ALD coated extrusion-coated packaging paper. Pinholes were artificially generated by ultra violet (UV) laser drilling through the polymer layer …

Transfer Process With 2-Dimensional Transitional Metal Dichalcogenides Materials, William Huang

Journal of the Microelectronic Engineering Conference

No abstract provided.

Fabrication Of Sub-300nm Fins At Rit By Sadp, Kelly Weiskittel

Journal of the Microelectronic Engineering Conference

No abstract provided.

Fabrication Of Photonic Lpcvd Silicon Nitride Waveguides, Robert Dalheim

Journal of the Microelectronic Engineering Conference

No abstract provided.

Single Electron Transistors For Molecular Computer Readout, Matthew Filmer

Journal of the Microelectronic Engineering Conference

No abstract provided.

Demonstration Of Record-High Mm-Wave Power Performance Using N-Polar Gallium Nitride Hemts, Brian Romanczyk

Journal of the Microelectronic Engineering Conference

Gallium Nitride high electron mobility transistors (GaN HEMTs) are proven to be well suited devices for highly efficient solid-state radio frequency power amplification, especially when high output power is desired. Existing GaN transistor technologies using the Ga-polar crystal orientation (0001) have been demonstrated operating at millimeter-wave frequencies (30 to 300 GHz). While these Ga-polar devices have demonstrated good large signal functionality, their performance has largely saturated. With growing interest in communication and imaging applications operating at mm-wave frequencies there is a need for transistors technologies with higher performance at these frequencies. This work focuses on the development and demonstration of …

Biristor Array Investigation, Jeremiah Leit

Journal of the Microelectronic Engineering Conference

No abstract provided.

Fefet Fabrication And Characterization At Rit, Jordan Merkel

Journal of the Microelectronic Engineering Conference

No abstract provided.

Mechanical And Tribological Behaviour Of Treated And Untreated Moringa Oleifera Pods Fiber Reinforced Epoxy Polymer Composite For Packaging Applications, Prakash Sampath, Senthil Kumar V.S Dr

Journal of Applied Packaging Research

Researchers now focus on the use of natural fiber polymer composites materials for packing applications. This attention is due to their low cost and renewable characteristics. Fabrication of composites with the use of renewable resources has many benefits of alternating from an appropriate management and reduction in industrial wastages, ecofriendly behaviour to cost effectiveness. The artificial fibers in packing industries can be replaced by natural fibers in the areas where stiffness and high strength are not the primary requirement. In the last decade the use of Natural fibers in the place of artificial fibers for reinforcements in epoxy resin matrix …

Biodegradable Polymeric Film For Food Packaging, Neelam Yadav, Raminder Kaur

Journal of Applied Packaging Research

Food packaging films that show post-consumer biodegradability are rarely explored by researchers. The present study was carried out to investigate the physicomechanical characteristics of ethyl cellulose (EC) based films to be used in food packaging. Ethyl cellulose was plasticized with different percentage of polyethylene glycol (PEG). The samples of standard dimensions were subjected to different testing such as soluble matter content, moisture content, oil permeability, surface morphology, mechanical testing etc. The data obtained was analysed to decide the moderate percentage of plasticizer that can be used to provide a rational explanation of a perfect quality specimen. It has been revealed …

Comparison Of Organic Food Packaging In Denmark, Finland, Germany, Great Britain And Italy, Sara Paunonen, Marja Pitkänen, Mika Vähä-Nissi, Ville Leminen, Mika Kainusalmi

Journal of Applied Packaging Research

The objective of this study was to provide a snapshot of organic food assortments in supermarkets in Denmark, Finland, Germany, Great Britain, and Italy, and compare the packages used for five organic food products (eggs, meat, fish, mushrooms, berries). In addition, a comparison was made between packaging for regular and organic whole eggs. The highest number of organic products was found in the Danish supermarket. The main difference between the countries was in the use of national organic logos. Of the different food products, egg cartons had the most variation in materials and visual design. In all countries the product …

Fabrication Of Photonic Lpcvd Silicon-Nitride Waveguides, Robert Dalheim

Journal of the Microelectronic Engineering Conference

The purpose of this project was to develop a repeatable process flow for Silicon-Nitride optical waveguides at RIT. Previous projects have fabricated optical waveguides out of amorphous silicon and polymers but never out of Nitride. The grating coupler pitch was varied from 700nm to 1500nm and the length was varied from 100μm to 1000μm. A target Nitride deposition thicknesses of 250nm, 500nm, and 750nm were deposited through LPCVD methods and were measured to be 150nm, 450nm, and 770nm. The thicknesses were chosen to be half the waveguide width for optimal transmission. Fabrication was successful for all three waveguide widths on …

Fabrication Of Algan/Gan High Electron Mobility Transistors, Vijay Gopal Thirupakuzi Vangipuram

Journal of the Microelectronic Engineering Conference

A first attempt at fabricating AlGaN/GaN High Electron Mobility Transistors (HEMTs) on a Si substrate was made at RIT. A basic process flow was developed to fabricate enhancement-mode devices. The proposed fabrication flow was attempted and completed. The single metallization step using Ni as the metal yielded Schottky contacts in source, drain and gate regions.

Fabrication Of Algan/Ganhigh Electron Mobility Transistors, Vijay Gopal T.V.

Journal of the Microelectronic Engineering Conference

No abstract provided.

Etching Process Characterization Of Nitride And Polysilicon Layer Using Trioniii Etcher, Sudmun Habib

Journal of the Microelectronic Engineering Conference

No abstract provided.

Transfer Process With 2d Transitional Metal Dichalcogenides Materials, William Huang

Journal of the Microelectronic Engineering Conference

The goal of this project is to expand RIT’s knowledge on non-traditional 2D materials and to develop a tape-transfer process for single to double atomic layers of Molybdenum Disulfide from a substrate containing bulk MoS2 to a blank substrate. The exfoliated materials will be inspected and characterized through both optical microscope and Raman Spectroscopy. The ultimate goal is to build it into devices to conduct electrical testing for its material and electrical properties. Material and electrical properties of the exfoliated materials will further be investigated and compared to MedeA simulation results.

Transfer Process With 2d Transitional Metal Dichalcogenides Materials, William Huang

Journal of the Microelectronic Engineering Conference

No abstract provided.

Capping Layers For Increased Thermal Stability Of Igzo Thin-Film Transistors, Jason Konowitch

Journal of the Microelectronic Engineering Conference

The goal of this project was to initially re-establish a baseline process for the fabrication of Indium-Gallium-Zinc Oxide thin-film transistors, shown in Figure 1, that have been a part of ongoing research here at RIT. After bringing the fabricated devices back into a reliable process, capping layer differences were investigated to determine their effects on device thermal stability. The time of the passivation layer anneal was varied between 3 and 4 hours for the primary lot and the temperature of the ALD capping layer was varied between 150°C and 200°C. The devices were tested and then thermally stressed on a …

Capping Layers For Increased Thermal Stability Of Igzo Thin-Film Transistors, Jason Konowitch

Journal of the Microelectronic Engineering Conference

No abstract provided.

Biristor Array Investigation, Jeremiah Dyson Leit

Journal of the Microelectronic Engineering Conference

No abstract provided.

Fefet Process Integration And Characterization, Jordan Merkel

Journal of the Microelectronic Engineering Conference

Hafnium oxide-based ferroelectrics are gaining popularity in the field of non-volatile memory due to their superior scalability in reference to traditional, lead-based ferroelectric materials and their compatibility with CMOS technology. Ferroelectric field-effect transistors (FeFETs) incorporate such materials in their gate stack, providing for bi-stable transfer characteristics and threshold voltages, which can be interpreted as storage values of 0 or 1. The difference between these threshold voltages is a FeFET figure of merit, referred to as the memory window (MW) of the device.

A process for fabricating n-channel FeFETs in-house at RIT has been developed, incorporating atomic layer deposition (ALD) of …

Fabrication Of Sub-300 Nm Fins At Rit By Sadp, Kelly Weiskittel

Journal of the Microelectronic Engineering Conference

The goal of fabricating sub-300 nm fins with the implementation of self-aligned double patterning (SADP) at Rochester Institute of Technology’s (RIT’s) Semiconductor & Microsystems Fabrication Laboratory (SMFL) was not realized completely. An energy dose meander was completed in order to qualify a new resist being used with the fabrication process that Christopher O’Connell developed for his graduate thesis. Manual spin coating of Spin-on-Carbon (SOC), bottom antireflective coating (BARC), and photoresist were all qualified. A 2:1 ratio of AZ MiR 701 photoresist to PGMEA was used to thin the resist for implementation of a 300 nm coat. Low pressure chemical vapor …

Biristor Array Investigation, Jeremiah Leit

Journal of the Microelectronic Engineering Conference

The biristor is a device that has interesting I-V characteristics. When it is current driven the reference device exhibits neural spiking. This neural spiking is characterized by a differing voltage at a steady current. If all of the devices on the chip that was designed exhibit this neural spiking behavior it has the potential of being used as a nueromorphic chip given its layout. The other method of operation is one in which a hysteresis loop is formed. This hysteresis loop can be used for hardware based encryption. This is because the device acts differently to the same stimulus based …

Fefet Fabrication And Characterization At Rit, Jordan Merkel

Journal of the Microelectronic Engineering Conference

No abstract provided.