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Electrical and Computer Engineering Faculty Publications and Presentations
Three-dimensional integrated circuits -- Technological innovations
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Thermal Management In 3d Ic Designs For Nano-Cmos Technologies: Analysis On Graphene- Vs. Graphite-Based Tim, Satya K. Vendra, Malgorzata Chrzanowska-Jeske
Thermal Management In 3d Ic Designs For Nano-Cmos Technologies: Analysis On Graphene- Vs. Graphite-Based Tim, Satya K. Vendra, Malgorzata Chrzanowska-Jeske
Electrical and Computer Engineering Faculty Publications and Presentations
With a high thermal conductivity of 3000-5000 W/m-K, Graphene outstands almost all materials in effective lateral heat spreading. Will introduction of 2D monolayer graphene in 3D-IC help in vertical heat conduction too? In this work, we investigate the impact of Graphene- and Graphite- -based inter-die thermal interface material (TIM) on the peak temperature of the 3D-IC. We compare configurations of additional intermediate layer (IL) of monolayer graphene, graphite and copper materials along with TIM. Simulations show a peak temperature reduction of up to 500C in GSRC benchmarks. Role of thermal conductivity and the additional IL critical thickness in peak temperature …