Engineering Commons^™

Comparing The Performance Of Different Machine Learning Models In The Evaluation Of Solder Joint Fatigue Life Under Thermal Cycling, Jason Scott Ross

Dissertations and Theses

Predicting the reliability of board-level solder joints is a challenging process for the designer because the fatigue life of solder is influenced by a large variety of design parameters and many nonlinear, coupled phenomena. Machine learning has shown promise as a way of predicting the fatigue life of board-level solder joints. In the present work, the performance of various machine learning models to predict the fatigue life of board-level solder joints is discussed. Experimental data from many different solder joint thermal fatigue tests are used to train the different machine learning models. A web-based database for storing, sharing, and uploading …

Improved Predictive Modeling Techniques For Non-Linear Solder Material Behavior, Arman Millian Ahari

Dissertations and Theses

Accurate prediction of fatigue life of solder joints in electronic packaging applications becomes of critical importance as semiconductor device technology and manufacturing constraints grow in complexity. To gain visibility on IC device performance and reliability, thermo-mechanical simulation is performed based on a unified, viscoplastic material model, which is dependent on nine parameters.

In this study, an improved method of Anand parameter extraction, which involves curve-fitting non-linear experimental stress data, is proposed to improve the accuracy of numerical predictions for solder reliability. Theoretical equations for uni-axial stress-strain response and creep response are derived, then details on their relevance to experimental and …

Reliability Of Solder Joints In Embedded Packages Using Finite Element Methods, Valeri Aisha Yunusa

Dissertations and Theses

Solder joints serve as both mechanical and electrical connections between elements in a package. They are subjected to shear strains generated as a result of the different behaviors of the elements in the package (tension and compression) due to the differences in coefficients of thermal expansion during service conditions.

Some of the causes of solder joint failures are due to the following:

Vibration: small rapid displacements of parts of the assembly. This is not necessarily an issue with electronic components but larger parts like automobiles.

Humidity: the package being exposed to water or ionic species can undergo corrosion if an …

Stress Analysis Of Embedded Devices Under Thermal Cycling, Sadhana Radhakrishnan

Dissertations and Theses

Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies.

Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical …