Engineering Commons^™

Stress Analysis For Chip Scale Packages With Embedded Active Devices Under Thermal Cycling, Hyunwook Yeo

Dissertations and Theses

One of the main challenges in the electronics manufacturing and packaging development is how to integrate more functions inside the same or even smaller size. To meet the demand for higher integration, the interest toward passive and active component embedding has been increasing during the past few years. One of the main reasons for the growing interest toward embedded active components, in addition to demand for higher packaging density, is the need for better electrical performance of the component assemblies. However, it is little known how embedded IC and passives affect the reliability of IC packaging.

Solder joints have been …

Anisotropy Of The Reynolds Stress Tensor In The Wakes Of Counter-Rotating Wind Turbine Arrays, Nicholas Michael Hamilton

Dissertations and Theses

A wind turbine array was constructed in the wind tunnel at Portland State University in a standard Cartesian arrangement. Configurations of the turbine array were tested with rotor blades set to rotate in either a clockwise or counter-clockwise sense. Measurements of velocity were made with stereo particle-image velocimetry. Mean statistics of velocities and Reynolds stresses clearly show the effect of direction of rotation of rotor blades for both entrance and exit row turbines. Rotational sense of the turbine blades is visible in the mean spanwise velocity W and the Reynolds shear stress -[macron over vw]. The normalized anisotropy tensor was …