Engineering Commons^™

Stress Analysis For Chip Scale Packages With Embedded Active Devices Under Thermal Cycling, Hyunwook Yeo

Dissertations and Theses

One of the main challenges in the electronics manufacturing and packaging development is how to integrate more functions inside the same or even smaller size. To meet the demand for higher integration, the interest toward passive and active component embedding has been increasing during the past few years. One of the main reasons for the growing interest toward embedded active components, in addition to demand for higher packaging density, is the need for better electrical performance of the component assemblies. However, it is little known how embedded IC and passives affect the reliability of IC packaging.

Solder joints have been …

Experimental Investigation Of Lateral Cyclic Behavior Of Wood-Based Screen-Grid Insulated Concrete Form Walls, John Stuart Garth

Dissertations and Theses

Insulated concrete forms (ICFs) are green building components that are primarily used for residential wall construction. Unlike most polystyrene based ICF variants, the Faswall ICFs used in these experiments were significantly denser because they were made from recycled wood particles and cement. The current design approach for structures constructed with this type of wall form only allows the designer to consider the contribution of the reinforced concrete cores. Previous research has shown that this approach may be conservative. This project experimentally evaluated the lateral structural response of these types of grid ICF walls under increasing amplitude of in-plane cyclic loading. …