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New Jersey Institute of Technology

1994

Water jet cutting.

Articles 1 - 2 of 2

Full-Text Articles in Engineering

Improvement Of Waterjet And Abrasive Waterjet Nozzle, Zheng Li Oct 1994

Improvement Of Waterjet And Abrasive Waterjet Nozzle, Zheng Li

Dissertations

This investigation is concerned with the improvement of the nozzle design for water and abrasive water jet machining. The mechanism of formation and characteristics of pure water and abrasive water jets are investigated in order to determine quasi-optimal process conditions.

To improve the pure water jet machining, a pulsed water jet nozzle, which employs the principle of the Helmholtz type resonator, is investigated experimentally and numerically. The experiments show the advantages of this nozzle over the commercial nozzle in cutting and cleaning. A numerical solution of the differential equations of continuity, momentum conservation, turbulent kinetic energy and dissipation for two …


Machining Of Silicon Wafers With An Abrasive Water Jet Cutter, Frank J. Marciniak Jan 1994

Machining Of Silicon Wafers With An Abrasive Water Jet Cutter, Frank J. Marciniak

Theses

This thesis consists of a study of the effects of abrasive water jet cutting on brittle silicon substrates. In total, 26 different cuts were made in a single crystal silicon substrate with an abrasive water jet cutter under different conditions of water flow, water pressure, and abrasive flow rate. These cuts were analyzed for surface roughness, and microstructure.

The roughness measurements were compared in order to determine the best possible cutting conditions. The cut with the best roughness of 0.000170 inches was obtained under cutting conditions of 30 KSI water pressure, 1 inch/minute cutting speed, and an abrasive flow rate …