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A Constitutive Model For Entangled Polymers Incorporating Binary Entanglement Pair Dynamics And A Configuration Dependent Friction Coefficient, David W. Mead, Nilanjana Banerjee, Joontaek Park
A Constitutive Model For Entangled Polymers Incorporating Binary Entanglement Pair Dynamics And A Configuration Dependent Friction Coefficient, David W. Mead, Nilanjana Banerjee, Joontaek Park
Chemical and Biochemical Engineering Faculty Research & Creative Works
Following recent work [e.g., J. Park et al., J. Rheol. 56, 1057-1082 (2012); T. Yaoita et al., Macromolecules 45, 2773-2782 (2012); and G. Ianniruberto et al., Macromolecules 45, 8058-8066 (2012)], we introduce the idea of a configuration dependent friction coefficient (CDFC) based on the relative orientation of Kuhn bonds of the test and surrounding matrix chains. We incorporate CDFC into the "toy" model of Mead et al. [Macromolecules 31, 7895-7914 (1998)] in a manner akin to Yaoita et al. [Nihon Reoroji Gakkaishi 42, 207-213 (2014)]. Additionally, we incorporate entanglement dynamics (ED) of discrete entanglement pairs into the new Mead-Banerjee-Park (MBP) …
Producing High Strength Aluminum Alloy By Combination Of Equal Channel Angular Pressing And Bake Hardening, Hamid Alihosseini, Mohsen Asle Zaeem, Kamran Dehghani, Ghader Faraji
Producing High Strength Aluminum Alloy By Combination Of Equal Channel Angular Pressing And Bake Hardening, Hamid Alihosseini, Mohsen Asle Zaeem, Kamran Dehghani, Ghader Faraji
Materials Science and Engineering Faculty Research & Creative Works
A combination of severe plastic deformation by equal channel angular pressing (ECAP) and bake hardening (BH) was used to produce high strength ultrafine-grained AA6061 aluminum alloy. 2, 4 and 8 passes of ECAP were performed, and the bake hardenability of samples was tested by 6% pre-straining followed by baking at 200 °C for 20 min. The microstructures obtained for various passes of ECAP were characterized by XRD, EBSD, and TEM techniques. The microstructures were refined from an average grain size of 20 µm to 212 nm after 8 passes of ECAP. Maximum bake hardenability of 110 MPa, and final yield …