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2010

University of Massachusetts Amherst

Electrical and Computer Engineering Faculty Publication Series

Articles 1 - 2 of 2

Full-Text Articles in Engineering

High Switching Endurance In TaoX Memristive Devices, Jianhua Yang, M Zhang, John Strachan, Feng Miao, Matthew Pickett, Ronald Kelley Dec 2010

High Switching Endurance In TaoX Memristive Devices, Jianhua Yang, M Zhang, John Strachan, Feng Miao, Matthew Pickett, Ronald Kelley

Electrical and Computer Engineering Faculty Publication Series

We demonstrate over 1×1010 open-loop switching cycles from a simple memristive device stack of Pt/TaO��/Ta. We compare this system to a similar device stack based on titanium oxides to obtain insight into the solid-state thermodynamic and kinetic factors that influence endurance in metal-oxide memristors.


Diffusion Of Adhesion Layer Metals Controls Nanoscale Memristive Switching, Jianhua Yang, John Strachan, Qiangfei Xia, Douglas Ohlberg, Philip Kuekes, Ronald Kelley, William Stickle, Duncan Stewart, Gilberto Medeiros-Ribeiro,, R Stanley Williams Jul 2010

Diffusion Of Adhesion Layer Metals Controls Nanoscale Memristive Switching, Jianhua Yang, John Strachan, Qiangfei Xia, Douglas Ohlberg, Philip Kuekes, Ronald Kelley, William Stickle, Duncan Stewart, Gilberto Medeiros-Ribeiro,, R Stanley Williams

Electrical and Computer Engineering Faculty Publication Series

Thermal diffusion of Ti through Pt electrode forms Ti atom channels of 1 nm diameter along Pt grain boundaries, seeding switching centers and controlling nanoscale memristive switching. The image shows EFTEM maps of Ti overlaid on HRTEM images for a Si/SiO2 100 nm/Ti 5nm/Pt 15 nm sample in-situ annealed in ultrahigh vacuum at 250 °C for 1 hour.