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Recent Development Of Surface Integral Equation Solvers For Multiscale Interconnects And Circuits, Sheng Sun, Lijun Jiang, Weng Cho Chew

Electrical and Computer Engineering Faculty Research & Creative Works

This paper presents a brief review and recent development of surface integral equation solvers for multiscale interconnects and circuits modeling. As the future production processes down to 5 nm and the operating frequency increases, both multi-scale and large-scale natures should be taken into account in the electromagnetic simulations. Fast, efficient, stable, and broadband integral equation based solvers become indispensable when millions or ten s of millions of unknowns might be involved in the simulation of the integrated circuit. Recent progress and our latest researches in the development of broadband fast electromagnetic solvers will be demonstrated. © 2013 IEEE.