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Full-Text Articles in Engineering
Optimized Waveform Relaxation Solution Of Electromagnetic And Circuit Problems, Martin J. Gander, Albert E. Ruehli
Optimized Waveform Relaxation Solution Of Electromagnetic And Circuit Problems, Martin J. Gander, Albert E. Ruehli
Electrical and Computer Engineering Faculty Research & Creative Works
New algorithms are needed to solve electromagnetic problems using today's widely available parallel processors. In this paper, we show that applying the optimized waveform relaxation approach to a partial element equivalent circuit will yield a powerful technique for solving electromagnetic problems with the potential for a large number of parallel processor nodes.
Causal Rlgc( Ƒ ) Models For Transmission Lines From Measured S-Parameters, Jianmin Zhang, James L. Drewniak, David Pommerenke, Marina Koledintseva, Richard E. Dubroff, Wheling Cheng, Zhiping Yang, Qinghua B. Chen, Antonio Orlandi
Causal Rlgc( Ƒ ) Models For Transmission Lines From Measured S-Parameters, Jianmin Zhang, James L. Drewniak, David Pommerenke, Marina Koledintseva, Richard E. Dubroff, Wheling Cheng, Zhiping Yang, Qinghua B. Chen, Antonio Orlandi
Electrical and Computer Engineering Faculty Research & Creative Works
Frequency-dependent causal RLGC(f) models are proposed for single-ended and coupled transmission lines. Dielectric loss, dielectric dispersion, and skin-effect loss are taken into account. The dielectric substrate is described by the two-term Debye frequency dependence, and the transmission line conductors are of finite conductivity. In this paper, three frequency-dependent RLGC models are studied. One is the known frequency-dependent analytical RLGC model ( RLGC-I), the second is the RLGC(f) model (RLGC-II) proposed in this paper, and the third (RLGC-III) is same as the RLGC -II, but with causality enforced by the Hilbert transform in frequency domain. The causalities of the three RLGC …
Eliminating Via-Plane Coupling Using Ground Vias For High-Speed Signal Transitions, Songping Wu, Xin Chang, Christian Schuster, Xiaoxiong Gu, Jun Fan
Eliminating Via-Plane Coupling Using Ground Vias For High-Speed Signal Transitions, Songping Wu, Xin Chang, Christian Schuster, Xiaoxiong Gu, Jun Fan
Electrical and Computer Engineering Faculty Research & Creative Works
When a high-speed signal transits through a via that penetrates a plane pair, parallel-plane resonances can cause additional insertion loss for the signal. To eliminate this via-plane coupling, ground vias are added adjacent to the signal via. This paper discusses the impact of the ground vias as a function of the number of the ground vias, their locations, and the size of the plane pair. A block-by-block physics-based equivalent circuit modeling approach is used in the study. The underlying physics of the phenomenon and the design implications are also discussed in the paper.
Differential Vias Transition Modeling In A Multilayer Printed Circuit Board, Matteo Cocchini, Wheling Cheng, Jianmin Zhang, John Fisher, Jun Fan, James L. Drewniak, Yaojiang Zhang
Differential Vias Transition Modeling In A Multilayer Printed Circuit Board, Matteo Cocchini, Wheling Cheng, Jianmin Zhang, John Fisher, Jun Fan, James L. Drewniak, Yaojiang Zhang
Electrical and Computer Engineering Faculty Research & Creative Works
A 26-layer printed circuit board including several test sites has been analyzed. All the sites have a transition from coupled microstrips to coupled striplines through signal vias. Differential measurements have been performed on some of these test sites to estimate the effect on S-parameters and eye diagrams due to via and antipad radius variation, and different lengths of via stub. The focus of this paper is on a test site with a transition from top to the sixth layer. At the same time, a physics based circuit model has been assembled in a spice-based simulation tool and a full-wave model …
Noise Coupling Between Power/Ground Nets Due To Differential Vias Transitions In A Multilayer Pcb, Matteo Cocchini, Jun Fan, Bruce Archambeault, James L. Knighten, Xin Chang, James L. Drewniak, Yaojiang Zhang, Samuel R. Connor
Noise Coupling Between Power/Ground Nets Due To Differential Vias Transitions In A Multilayer Pcb, Matteo Cocchini, Jun Fan, Bruce Archambeault, James L. Knighten, Xin Chang, James L. Drewniak, Yaojiang Zhang, Samuel R. Connor
Electrical and Computer Engineering Faculty Research & Creative Works
Due to the increase in board density, routing traces on different layers becomes a widely used strategy. Through-hole vias are often used to connect these traces. Those vias that penetrate power/ground plane pairs could cause noise coupling between signal and power/ground nets. At the same time, the need for clean signal transmitted to receivers results in a wide use of differential signals. This paper studies the noise coupling mechanism caused by a differential pair of vias penetrating power/ground plane pair using a physics-based via-plane model combined with transmission line models for traces. A 26-layer printed circuit board with a pair …
Modeling Of The Ic's Switching Currents On The Power Bus Of A High Speed Digital Board, Mauro Lai, James L. Drewniak, Vittorio Ricchiuti, Antonio Orlandi, Giulio Antonini
Modeling Of The Ic's Switching Currents On The Power Bus Of A High Speed Digital Board, Mauro Lai, James L. Drewniak, Vittorio Ricchiuti, Antonio Orlandi, Giulio Antonini
Electrical and Computer Engineering Faculty Research & Creative Works
When the performances of the electronic technology increase (higher frequencies, more power, lover power supply, faster transistors, reduced chip dimensions), designing electronic equipment becomes more challenging for the electronic engineers. Signal and power integrity on board become of paramount importance. One of the main causes of board malfunctions and electromagnetic radiation is the simultaneous switching noise (SSN) due to the integrated circuits soldered on the board. The paper proposes two simple procedures to model the SSN, so to evaluate its effects in any point of the board.
Dc Power Bus Modeling Using A Circuit Extraction Approach Based On A Mixed-Potential Integral Equation Formulation And An Iterative Equation Solver, Jun Fan, James L. Drewniak, James L. Knighten
Dc Power Bus Modeling Using A Circuit Extraction Approach Based On A Mixed-Potential Integral Equation Formulation And An Iterative Equation Solver, Jun Fan, James L. Drewniak, James L. Knighten
Electrical and Computer Engineering Faculty Research & Creative Works
A quick and simple approach is developed to perform circuit simulations for an equivalent circuit extracted from a first principles formulation for DC power bus structures. The simulations are done by solving the system equation using an iterative method. Good agreement between modeling and measurements demonstrate the effectiveness of the method, which is very suitable and computationally efficient for frequency-domain DC power modeling.