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California Polytechnic State University, San Luis Obispo

Materials Engineering

1991

Articles 1 - 2 of 2

Full-Text Articles in Engineering

Apparatus And Method For Automatically Identifying Chemical Species Within A Plasma Reactor Environment, Richard N. Savage May 1991

Apparatus And Method For Automatically Identifying Chemical Species Within A Plasma Reactor Environment, Richard N. Savage

Materials Engineering

A method and apparatus to control the plasma environment in a semiconductor or thin-film fabrication chamber. The apparatus and method include a means for measuring an optical emission spectrum of the chemical species in the plasma and a library containing a multiplicity of predefined spectral patterns. A processor automatically correlates the spectrum with the predefined spectral patterns in the library, and yields a correlation value for all the correlations. A subset of the predefined spectral patterns based upon the highest correlation values are selected and used to identify the chemical species and abundances thereof in the plasma. A comparator compares …


In-Situ Film Thickness Measurements For Real-Time Monitoring And Control Of Advanced Photoresist Track Coating Systems, Richard N. Savage, Thomas E. Metz, Horace O. Simmons Jan 1991

In-Situ Film Thickness Measurements For Real-Time Monitoring And Control Of Advanced Photoresist Track Coating Systems, Richard N. Savage, Thomas E. Metz, Horace O. Simmons

Materials Engineering

This paper explores the methodologies of real-time measurement of photoresist film thickness on silicon wafers using multi-wavelength reflection interferometry. Reflected light from the wafer's surface, containing the interference profile, is collected in-situ via a fiber optic cable and film thickness is determined in real-time via a pattern recognition algorithm. The instrumentation used to make this measurement and its application toward optimizing track performance during spin-coating and back are discussed. Data demonstrating basic thickness versus spin-time and thickness versus bake-time profiles acquired on-line without process disruption are presented along with its utilization toward minimizing process set-up and machine qualification. Moreover, the …