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Metallurgy

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Missouri University of Science and Technology

Materials Science and Engineering Faculty Research & Creative Works

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1971

Articles 1 - 6 of 6

Full-Text Articles in Engineering

Thermal Expansion Of Tungsten At Low Temperatures, Jayant S. Shah, Martin E. Straumanis Dec 1971

Thermal Expansion Of Tungsten At Low Temperatures, Jayant S. Shah, Martin E. Straumanis

Materials Science and Engineering Faculty Research & Creative Works

Lattice parameters, thermal expansion coefficients, and Grüneisen parameters of tungsten are determined by an x-ray method in the temperature range of 180-40 K without the use of liquid gases. Lattice parameters are expressed as a function of temperature. Thermal-expansion coefficients decrease with temperature and show no anomaly in contrast to a hypothesis proposed by Featherston and Neighbours. Grüneisen parameters γ are decreasing with temperature in accordance with the theoretical predictions. © 1971 The American Institute of Physics.


The Anodic Dissolution Reaction Of Insb: Etch Patterns, Electron Number, Anodic Disintegration, And Film Formation, Martin E. Straumanis, Lih Da Hu Jan 1971

The Anodic Dissolution Reaction Of Insb: Etch Patterns, Electron Number, Anodic Disintegration, And Film Formation, Martin E. Straumanis, Lih Da Hu

Materials Science and Engineering Faculty Research & Creative Works

The etching behavior of the inverse {111} planes of undoped, semiconducting, n-type, InSb single crystals was explored. Depending upon the etchant, including anodic dissolution, various etch patterns were obtained on the inverse planes. In general, the etch pits on the In{111} plane were round, and the face was shiny, whereas the face of the inverse plane was dark and rough. The rates of dissolution in the electrolytes used were very low, especially in absence of oxidizers. The components dissolve as In3+ and Sb3 +. At current densities above 40 or 60 mA cm-2 (on Sb{111} or In{111}), growth of a …


Activation Volumes Of Interstitial Diffusion In Ferromagnetic Metals And Alloys, Manfred Wuttig, J. Keiser Jan 1971

Activation Volumes Of Interstitial Diffusion In Ferromagnetic Metals And Alloys, Manfred Wuttig, J. Keiser

Materials Science and Engineering Faculty Research & Creative Works

The Dis accommodation technique was used to determine the activation volumes of carbon diffusion ΔV of a Fe-1.4 wt% Si alloy, of hcp cobalt, and of nickel at the temperatures of -21, 75, and 110°C, respectively. The obtained values of ΔV are +0.3 ± 0.3 and -0.6 ± 0.9 cm3 mole-1 for the two relaxations observed in hcp cobalt, and 1.2 ± 0.1 cm3 mole-1 for nickel. These results are discussed in terms of a continuum model that interprets the activation energy of diffusion as a sum of the strain and exchange energies. It is found that in ferromagnetic solids …


On The Activation Entropy Of Interstitial Diffusion In B.C.C. Iron, Manfred Wuttig Jan 1971

On The Activation Entropy Of Interstitial Diffusion In B.C.C. Iron, Manfred Wuttig

Materials Science and Engineering Faculty Research & Creative Works

No abstract provided.


A Magnetic Aftereffect In Dilute H.C.P. Co-C Alloys, J. R. Keiser, Manfred Wuttig Jan 1971

A Magnetic Aftereffect In Dilute H.C.P. Co-C Alloys, J. R. Keiser, Manfred Wuttig

Materials Science and Engineering Faculty Research & Creative Works

A magnetic Dis accommodation in dilute h.c.p. Co-C alloys has been observed around 90°C. The thermally activated process giving rise to the Dis accommodation is characterized by an activation energy of 26 kcal mole-1 and an attack frequency on the order of 10+13 sec-1. An application of the selection rules shows that the Dis accommodation cannot be caused by the redistribution of tetrahedral or octahedral interstitials or any nearest neighbor interstitial pairs as long as the defects interact linearly with the internal magnetic field. © 1971.


Stored Energy Of Room Temperature Deformed Copper, G. J. Filatovs, Hollis P. Leighly Jan 1971

Stored Energy Of Room Temperature Deformed Copper, G. J. Filatovs, Hollis P. Leighly

Materials Science and Engineering Faculty Research & Creative Works

No abstract provided.