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Full-Text Articles in Engineering

Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri Oct 1999

Gauge Repeatability & Reproducibility Study For A 3-D Solder Paste Inspection System, Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer, Ronald M. Sallade, David J. Leandri

Industrial and Manufacturing Engineering

Due to the increased use of Ball Grid Arrays (BGAs) and fine pitch and ultra fine pitch Quad Flat Packages (QFPs), there is a dramatic increase in demand for solder paste inspection after the stencil printing process. The important response variables of the printing process are deposited solder paste volume, area, height and position. To identify and remove defects at the earliest possible process step, a 3-D solder paste inspection system should be used to monitor solder paste deposited on all pads on every board before component placement. An example is a fully automatic laser-based 3-D triangulation solder paste inspection …


Triangulation Rangefinder And Sight Positioning System, Jeffrey Hargrove, William G. Wickham, John E. Briggs Jun 1999

Triangulation Rangefinder And Sight Positioning System, Jeffrey Hargrove, William G. Wickham, John E. Briggs

Mechanical Engineering Patents

A rangefinder includes an angle sensitive transducer and a programmed data processor to calculate the distance to a target. In one embodiment, the rangefinder also includes a point-to-point measuring device. Another embodiment provides a linear actuator to selectively move a sight indicator vertically. A yet additional embodiment includes a liquid crystal display which displays information to the user.