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The Effect Of Polydispersivity On The Thermal Conductivity Of Particulate Thermal Interface Materials, Sasanka Kanuparthi, Ganesh Subbarayan, Thomas Siegmund, Bahgat Sammakia
The Effect Of Polydispersivity On The Thermal Conductivity Of Particulate Thermal Interface Materials, Sasanka Kanuparthi, Ganesh Subbarayan, Thomas Siegmund, Bahgat Sammakia
School of Mechanical Engineering Faculty Publications
A critical need in developing thermal interface materials (TIMs) is an understanding of the effect of particle/matrix conductivities, volume loading of the particles, the size distribution, and the random arrangement of the particles in the matrix on the homogenized thermal conductivity. Commonly, TIM systems contain random spatial distributions of particles of a polydisperse (usually bimodal) nature. A detailed analysis of the microstructural characteristics that influence the effective thermal conductivity of TIMs is the goal of this paper. Random microstructural arrangements consisting of lognormal size-distributions of alumina particles in silicone matrix were generated using a drop-fall-shake algorithm. The generated microstructures were …
An Efficient Network Model For Determining The Effective Thermal Conductivity Of Particulate Thermal Interface Materials, S Kanuparthi, G Subbarayan, Thomas Siegmund, B Sammakia
An Efficient Network Model For Determining The Effective Thermal Conductivity Of Particulate Thermal Interface Materials, S Kanuparthi, G Subbarayan, Thomas Siegmund, B Sammakia
School of Mechanical Engineering Faculty Publications
Particulate composites are commonly used in Microelectronics applications. One example of such materials is Thermal Interface Materials (TIMs) that are used to reduce the contact resistance between the chip and the heat sink. The existing analytical descriptions of thermal transport in particulate systems do not accurately account for the effect of inter-particle interactions, especially in the intermediate volume fractions of 30-80%. Another crucial drawback in the existing analytical as well as the network models is the inability to model size distributions (typically bimodal) of the filler material particles that are obtained as a result of the material manufacturing process. While …