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Effects Of Hydroquinone And Gelatin On The Electrodeposition Of Sn-Bi Low Temperature Pb-Free Solder
Effects Of Hydroquinone And Gelatin On The Electrodeposition Of Sn-Bi Low Temperature Pb-Free Solder
A.S. Md Abdul Haseeb
The effects of an antioxidant, hydroquinone (HQ) and a grain refining additive, gelatin, on the electroplating characteristics of Sn-Bi alloys were investigated. Methane sulfonic acid (MSA) based plating baths with varying contents of additives were prepared and the electrochemical behavior of each bath was investigated. The combination of HQ and gelatin successfully reduces the deposition potential gap between the elements hence facilitates the co-deposition of Sn-Bi in this plating bath. Compact, adherent deposits could be obtained through the synergistic effects of these two additives. The electroplated Sn-Bi deposits showed a decrease in Bi content with increasing current density. Near eutectic …
Electrodeposition Of Lead-Free Solder Alloys
Electrodeposition Of Lead-Free Solder Alloys
A.S. Md Abdul Haseeb
Purpose - The purpose of this paper is to enhance the understanding on the electrodeposition of various lead (Pb)-free solder alloys, so that new studies can be carried out to solve processing issues. Design/methodology/approach - The paper reviews the available reports on the electrodeposition of tin (Sn)-based solder systems and identifies the challenges in this area. Findings - Compositional control remains a major challenge in this area, where the achievement of desired composition for binary and ternary alloys is subjected to uncertainties. The use of chelating agents in the bath and optimization of parameters can assist the achievement of near-desired …