Engineering Commons^™

A Study Of Gas Holdup Properties Of Selected Non-Newtonian Simulants, Milena Abarca

FIU Electronic Theses and Dissertations

The U.S. Department of Energy (DOE) needs a design basis to properly design a PJM and ventilation systems for the Waste Treatment Plant vessels. In order to meet DOE's needs for proper ventilation and PJM design technologies, Florida International University's Hemispheric Center for Environmental Technology (FIU-HCET) has studied the properties for gas holdup in selected non Newtonian fluids with physicochemical properties comparable to nuclear waste.

The primary purpose of this research was to study the holdup properties of selected non - Newtonian simulants and quantify the level of gas holdup in selected simulants using continuous argon injection in five gallons …

Double Diffusive Convection During Solidification Of Ammonium Chloride - Water (Nh4cl-H20) Mixture In A Trapezoidal Cavity, Ravi Kumar Duggirala

FIU Electronic Theses and Dissertations

The effect of the initial concentration of ammonium chloride (sub eutectic: C < 19.8 wt. % and eutectic C_e= 19.8 wt. %) and boundary temperatures (T_cold = -30 ⁰C to -10 ⁰C) on the solidification process is examined. Particle Image Velocimetry (PIV) is used in this study to measure the velocity fields in the melt during the solidification process. The distributions of temperatures at discrete locations in the solution and the boundary walls were measured. This study focuses on the solidification of an ammonium chloride-water (NH₄Cl- H₂O) solution in a trapezoidal cavity with one and two inclined cooling …

Design And Analysis Of Micro-Channel Heat-Exchanger Embedded In Low Temperature Co-Fire Ceramic (Ltcc), Hari Kishore Adluru

FIU Electronic Theses and Dissertations

Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm²; however current microprocessors are operating at levels of 100W/cm², This demands the usage of novel thermal-management systems. In this work, water-cooling systems with active heat sink are embedded in the substrate.

The research involved fabricating LTCC substrates of various configurations - an open-duct substrate, the second with thermal vias and the third with thermal vias and free-standing metal …