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Full-Text Articles in Engineering
Project-Based Introductory To Materials Engineering Modules On Biomaterials, Solid Oxide Fuel Cells, Non-Volatile Memory, And Fiber Reinforced Plastics, Stacy Gleixner, Elliot Douglas, Olivia Graeve
Project-Based Introductory To Materials Engineering Modules On Biomaterials, Solid Oxide Fuel Cells, Non-Volatile Memory, And Fiber Reinforced Plastics, Stacy Gleixner, Elliot Douglas, Olivia Graeve
Faculty Publications
PRIME Modules, Project Based Resources for Introduction to Materials Engineering, are being developed that utilize modern materials science and engineering technologies and proven education methodologies of active learning and open ended projects. The modules are designed for use in a freshmen/ sophomore level Introduction to Materials Engineering course. This course is required by most engineering programs and is an ideal place to excite students about their engineering majors and expose them to real world engineering experiences. Currently four of the classroom modules have been developed and utilized in Introduction to Materials classes. There is a non-volatile memory module where students …
The Microstructure And Grain Size Of Jet Electroplated Copper Films In Damascene Trench Features, Andrew Tzanavaras, Gregory Young, Stacy H. Gleixner
The Microstructure And Grain Size Of Jet Electroplated Copper Films In Damascene Trench Features, Andrew Tzanavaras, Gregory Young, Stacy H. Gleixner
Faculty Publications
The brightening additive level and dc current density of electroplating baths are two parameters that affect the gap-filling capability and the degree of impurity incorporation in electroplated copper films. Additive incorporation can inhibit grain growth during the room temperature recrystallization process and therefore affect the final grain size. This investigation explores the grain size and microstructure of dc jet-electroplated copper films in 0.35 and 0.50μm Damascene trenches as a function of current density and brightening additive level after first receiving a high-temperature anneal. Unlike a previous study that explored these variables in blanket Cu films [ J. Electrochem. Soc. , …
Combinatorial Study Of Ni-Ti-Pt Ternary Metal Gate Electrodes On Hfo2 For The Advanced Gate Stack, K.-S. Chang, M. L. Green, J. Suehle, E. M. Vogel, H. Xiong, Jason R. Hattrick-Simpers, I. Takeuchi, O. Famodu, K. Ohmori, P. Ahmet, T. Chikyow, P. Majhi, B.-H. Lee, M. Gardner
Combinatorial Study Of Ni-Ti-Pt Ternary Metal Gate Electrodes On Hfo2 For The Advanced Gate Stack, K.-S. Chang, M. L. Green, J. Suehle, E. M. Vogel, H. Xiong, Jason R. Hattrick-Simpers, I. Takeuchi, O. Famodu, K. Ohmori, P. Ahmet, T. Chikyow, P. Majhi, B.-H. Lee, M. Gardner
Faculty Publications
The authors have fabricated combinatorial Ni–Ti–Pt ternary metal gate thin film libraries on HfO2 using magnetron co-sputtering to investigate flatband voltage shift (ΔVfb) , work function (Φm) , and leakage current density (JL) variations. A more negative ΔVfb is observed close to the Ti-rich corner than at the Ni- and Pt-rich corners, implying smaller Φm near the Ti-rich corners and higher Φm near the Ni- and Pt-rich corners. In addition, measured JL values can be explained consistently with the observed Φm variations. Combinatorial methodologies prove to be useful …