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Engineering Commons

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Materials Science and Engineering

Economics Faculty Research & Creative Works

Series

2006

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Full-Text Articles in Engineering

Method And Apparatus For Solder-Less Attachment Of An Electronic Device To A Textile Circuit, James A. Zollo, Bonnie Bachman, Alan R. Beatty, Stephen O. Bozzpme, Nitin B. Desai, Ronald J. Kelley, Rami C. Levy Apr 2006

Method And Apparatus For Solder-Less Attachment Of An Electronic Device To A Textile Circuit, James A. Zollo, Bonnie Bachman, Alan R. Beatty, Stephen O. Bozzpme, Nitin B. Desai, Ronald J. Kelley, Rami C. Levy

Economics Faculty Research & Creative Works

A method and apparatus form electrical connections between electronic circuits and conductive threads (102, 104, 106, 108) that are interwoven into textile material (130). Electronic circuits (128), such as semiconductor dies, are connected to a carrier (132) and electrical connections (136) are made to conductive connection areas (110, 112, 114, 116) on the carrier (132). Conductive stitching (202, 204, 206, 208) provides electrical contacts for both the conductive connection areas (110, 112, 114, 116) on the carrier (132) and the conductive threads (102, 104, 106, 108) that are interwoven into the textile material (130). Optionally, a thin, flexible substrate material …