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Full-Text Articles in Engineering
Characterization And Modeling Of Asphalt Concrete For Dynamic Properties And Performances, A S M A. Rahman
Characterization And Modeling Of Asphalt Concrete For Dynamic Properties And Performances, A S M A. Rahman
Civil Engineering ETDs
The recently developed mechanistic-empirical pavement design guide (MEPDG, also known as Pavement M-E design method) uses the nationally calibrated, binder viscosity-based dynamic modulus predictive model for the design and analysis of asphalt pavements. In this study, this model is assessed for its appropriateness for asphalt-aggregate mixtures typically used in New Mexico. In essence, this study investigates the predictability issue of complex modulus of New Mexico mixes. A total of 54 Superpave mixes with different aggregate gradations, air voids, and binder grades were collected from the mixing plants and from the pavement construction sites. The loose asphalt mixtures were then compacted, …
Modeling And Studying The Effect Of Texture And Elastic Anisotropy Of Copper Microstructure In Nanoscale Interconnects On Reliability In Integrated Circuits, Adarsh Basavalingappa
Modeling And Studying The Effect Of Texture And Elastic Anisotropy Of Copper Microstructure In Nanoscale Interconnects On Reliability In Integrated Circuits, Adarsh Basavalingappa
Legacy Theses & Dissertations (2009 - 2024)
Copper interconnects are typically polycrystalline and follow a lognormal grain size distribution. Polycrystalline copper interconnect microstructures with a lognormal grain size distribution were obtained with a Voronoi tessellation approach. The interconnect structures thus obtained were used to study grain growth mechanisms, grain boundary scattering, scattering dependent resistance of interconnects, stress evolution, vacancy migration, reliability life times, impact of orientation dependent anisotropy on various mechanisms, etc. In this work, the microstructures were used to study the impact of microstructure and elastic anisotropy of copper on thermal and electromigration induced failure.