Engineering Commons^™

Heat Transfer In Silicon - Experiments And Simulation, Chihlin Huang

Theses

The purpose of this thesis is to study the heat transfer in silicon. Silicon is the key semiconductor material, and thermal processing is the traditional method that is used in semiconductor processing. In this research, we can predict the temperature of the silicon wafer during heating. This ability to predict wafer temperature during semiconductor processing will facilitate in the following: (a) Process temperature uniformity, (b) Film thickness uniformity, (c) Diffusion, (d) Process yield, (e) Thermally induced stresses, and (f) Device yield - spatially and temporally across the wafer. For low temperature applications, IC chips can be modeled to simulate the …