Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 2 of 2
Full-Text Articles in Engineering
Evaluation Of The Effects Of A Plasma Activated Medium On Cancer Cells, S. Mohades, M. Laroussi, J. Sears, N. Barekzi, H. Razavi
Evaluation Of The Effects Of A Plasma Activated Medium On Cancer Cells, S. Mohades, M. Laroussi, J. Sears, N. Barekzi, H. Razavi
Electrical & Computer Engineering Faculty Publications
The interaction of low temperature plasma with liquids is a relevant topic of study to the field of plasma medicine. This is because cells and tissues are normally surrounded or covered by biological fluids. Therefore, the chemistry induced by the plasma in the aqueous state becomes crucial and usually dictates the biological outcomes. This process became even more important after the discovery that plasma activated media can be useful in killing various cancer cell lines. Here, we report on the measurements of concentrations of hydrogen peroxide, a species known to have strong biological effects, produced by application of plasma to …
Temporary Bonding With Polydimethylglutarimide Based Lift Off Resist As A Layer Transfer Platform, T. Matsumae, A. D. Koehler, J. D. Greenlee, T. J. Anderson, H. Baumgart, G. G. Jernigan, K. D. Hobart, F. J. Kub
Temporary Bonding With Polydimethylglutarimide Based Lift Off Resist As A Layer Transfer Platform, T. Matsumae, A. D. Koehler, J. D. Greenlee, T. J. Anderson, H. Baumgart, G. G. Jernigan, K. D. Hobart, F. J. Kub
Electrical & Computer Engineering Faculty Publications
Bonding of lift off resist (LOR) was performed to realize temporary wafer bonding without residue. Bonding process conditions such as spin speed, pre-bake temperature, and bonding temperature were optimized to obtain a large bonded area with high bond strength. Under optimized process conditions, a bonded area covering over 98% of the wafer surface, with a room temperature bond strength of nearly 5 J/m2 is achieved. During razor blade testing, fracture often occurs at the Si wafer. Moreover, debonding using an N-Methyl-2-pyrrolidone (NMP)-based solvent left the wafer surface extremely small amount of residue. Thus, the optimized bonding processed developed in …