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Full-Text Articles in Engineering
Pioneering Concepts For 3d Electromagnetics, Cesar Valle
Pioneering Concepts For 3d Electromagnetics, Cesar Valle
Open Access Theses & Dissertations
This work introduces two paradigm changing concepts that will push electromagnetics (EM) to the third dimension. The first of that work involves the introduction of the conformal Spatially Variant Lattice (SVL) algorithm that can conform any periodic structure onto arbitrary curvature. The algorithms robustness is confirmed by conforming a frequency selective surface (FSS) onto an extreme paraboloid, proving the algorithms robustness on high sloping surfaces. Three FSSs were made in total; a standard flat FSS, a projected FSS, and a FSS made through the conformal SVL algorithm. Measured results are shown and match well to simulation.Secondly, in the world of …
Measuring The Electrical Properties Of 3d Printed Plastics In The W-Band, Noah Gregory
Measuring The Electrical Properties Of 3d Printed Plastics In The W-Band, Noah Gregory
Electrical Engineering Undergraduate Honors Theses
3D printers are a method of additive manufacturing that consists of layering material to produce a 3D structure. There are many types of 3D printers as well as many types of materials that are capable of being printed with. The most cost-effective and well documented method of 3D printing is called Fused Deposition Modeling (FDM). FDM printers work by feeding a thin strand of plastic filament through a heated extruder nozzle. This plastic is then deposited on a flat, typically heated, surface called a print bed. The part is then built by depositing thin layers of plastic in the shape …
Experimental Validation Of A 3d-Printed Millimeter Wave/Thz Power Combiner, Jacob C. Giese
Experimental Validation Of A 3d-Printed Millimeter Wave/Thz Power Combiner, Jacob C. Giese
Electrical and Computer Engineering ETDs
The terahertz band (THz) in the electromagnetic spectrum is an untapped resource that possesses unique features for nondestructive methods of material imaging and detection. However, little advancements have been made in regard to a practical long range portable THz device. The solution proposed is an oversized cylindrical waveguide termed Power Combiner, designed to combine 12 azimuthally aligned rectangular waveguides to produce power levels suitable for threat detection at secure distances. This paper explores the physical parameters of the power combiner and the power distribution network and creates the 12 signals that allow for modification at the input of the power …
Hybrid 3d Printing Demonstrated By Arbitrary 3d Meandering Transmission Lines, Ubaldo Robles
Hybrid 3d Printing Demonstrated By Arbitrary 3d Meandering Transmission Lines, Ubaldo Robles
Open Access Theses & Dissertations
This Dissertation focuses on the automation of multi-material direct write three-dimensional (3D) manufacturing of arbitrary metal-dielectric structures. The technology was demonstrated by manufacturing 3D meandering interconnects and transmission lines (TLs). Manufacturing 3D functional electronics with multiple materials required pushing the current state of 3D printing (3DP) technology to utilize simultaneous multi-material processes combined with sophisticated slicing and bonding under one process. Multi material 3DP is known as hybrid 3DP. This research pioneered the process for producing meandering transmission lines, starting with design and manufacturing, using hybrid 3DP through micro-dispensing and fuse deposition modeling. The research starts by 3DP magnetic and …
Numerical Calculation Of Spatially Variant Anisotropic Metamaterial, Asad Ullah Hil Gulib
Numerical Calculation Of Spatially Variant Anisotropic Metamaterial, Asad Ullah Hil Gulib
Open Access Theses & Dissertations
3D printing, or additive manufacturing, is rapidly evolving into a mainstream manufacturing technology that is creating new opportunities for electromagnetics and circuits. 3D printing permits circuits to fully utilize the third dimension allowing more functions in the same amount of space and allows the devices to have arbitrary form factors. 3D printing is letting us discover new physics that is not possible in standard 2D circuits and devices. However, evolving electromagnetics and circuits into three dimensions introduces some serious problems like thermal management, interference, and mutual coupling between the components which degrades performance and hurts signal integrity.
Metamaterials are engineered …
A Study Of Direct Digital Manufactured Rf/Microwave Packaging, John W.I. Stratton
A Study Of Direct Digital Manufactured Rf/Microwave Packaging, John W.I. Stratton
USF Tampa Graduate Theses and Dissertations
Various facets of direct digital manufactured (DDM) microwave packages are studied. The rippled surface inherent in fused deposition modeling (FDM) fabricated geometries is modeled in Ansoft HFSS, and its effect on the performance of microstrip transmission lines is assessed via simulation and measurement. The thermal response of DDM microstrip transmission lines is analyzed over a range of RF input powers, and linearity is confirmed over that range.
Two IC packages are embedded into DDM printed circuit boards, and their performance is analyzed. The first is a low power RF switch, and the second is an RF front end device that …
3d Printed Impedance Elements By Micro-Dispensing, Ubaldo Robles Dominguez
3d Printed Impedance Elements By Micro-Dispensing, Ubaldo Robles Dominguez
Open Access Theses & Dissertations
Micro-dispensing allows electric circuits to be "3D printed," which can be used to give 3D printed systems electronic and electromagnetic functionality. The focus of this thesis is using micro-dispensing to fabricate capacitors and inductors. 3D printed impedance elements are capable of being more easily embedded, can be used to create structural electronics, and will have extensive applications in antennas, metamaterials, frequency selective surfaces, and more. This is the first known effort to print and measure impedance elements by micro-dispensing which holds great potential for manufacturing multi-material devices.