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Nonmetallic Jet Impingement Thermal Management For Power Electronics Via Additive Manufacturing, Reece Whitt
Nonmetallic Jet Impingement Thermal Management For Power Electronics Via Additive Manufacturing, Reece Whitt
Graduate Theses and Dissertations
The increase in energy demanded by transportation and energy sectors has necessitated highly efficient thermal management for reliable power electronics operations. Conventional cooling techniques are limited by their inability to target switching location hot spot temperatures, leading to non-uniform thermal gradients. These devices, such as cold plates and heat sinks, also utilize heavy metallic structures that can accentuate electromagnetic interferences generated by high voltage switching processes. This work proposes a non-metallic jet impingement cooler for more customized thermal management, while simultaneously reducing the harmful effects of electromagnetic interferences. Additive manufacturing is utilized to enable jet impingement zones to target individual …
Microheater Array Powder Sintering (Maps) For Printing Flexible Electronics, Nicholas Holt
Microheater Array Powder Sintering (Maps) For Printing Flexible Electronics, Nicholas Holt
Graduate Theses and Dissertations
Microheater array powder sintering (MAPS) is a novel additive manufacturing process that uses an array of microheaters to selectively sinter powder particles. MAPS shows great promise as a new method of printing flexible electronics by enabling digital curing of conductive inks on a variety of substrates. MAPS operation relies on establishing a precision air gap of a few microns between an array of microheaters, which can reach temperatures of 600°C, and a layer of conductive ink which can be deposited onto a flexible substrate. This system presents challenges, being: the fabrication of a microheater that can reach suitable temperatures in …