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Articles 1 - 6 of 6
Full-Text Articles in Engineering
A Simplified Accuracy Enhancement To The Saleh Am/Am Modeling And Linearization Of Solid-State Rf Power Amplifiers, Haider Al-Kanan, Fu Li
A Simplified Accuracy Enhancement To The Saleh Am/Am Modeling And Linearization Of Solid-State Rf Power Amplifiers, Haider Al-Kanan, Fu Li
Electrical and Computer Engineering Faculty Publications and Presentations
The Saleh behavioral model exhibits high prediction accuracy for nonlinearity of traveling-wave tube power amplifiers (TWT-PAs). However, the accuracy of the Saleh model degrades when modeling solid-state power amplifiers (SSPAs) technology. In addition, the polynomial expansion of the Saleh model consists of only odd-order terms as analyzed in this work. This paper proposes a novel model accuracy enhancement for the Saleh amplitude-to-amplitude (AM/AM) model when applied to radio frequency (RF) SSPAs. The proposed model enhancement accounts for the second-order intermodulation distortion, which is an important nonlinearity challenge in wideband wireless communications. The proposed static AM/AM model is a three-parameter rational …
Spectrum Modeling Of Out-Of-Band Intermodulation For Dual-Band Rf Amplifiers In Ofdm Modulation, Xianzhen Yang, Siyuan Yan, Xiao Li, Qiang Wu, Fu Li
Spectrum Modeling Of Out-Of-Band Intermodulation For Dual-Band Rf Amplifiers In Ofdm Modulation, Xianzhen Yang, Siyuan Yan, Xiao Li, Qiang Wu, Fu Li
Electrical and Computer Engineering Faculty Publications and Presentations
Dual-band RF amplifiers play increasingly important roles in next-generation mobile communication systems including 5G, and the out-of-band intermodulation products are often not negligible since they generate interference to adjacent channels. In this article, following our previous modeling of cross-modulation for amplified dual-band signals, an analytical expression of out-of-band intermodulation for dual-band orthogonal frequency-division multiplexing signals is derived using the third-order intercept points IP3. The experimental measurement results validate the proposed analytical expression.
A High Torque Density Halbach Rotor Coaxial Magnetic Gear, Ho Yin Wong, Jonathan Z. Bird, David Barnett, Wesley Williams
A High Torque Density Halbach Rotor Coaxial Magnetic Gear, Ho Yin Wong, Jonathan Z. Bird, David Barnett, Wesley Williams
Electrical and Computer Engineering Faculty Publications and Presentations
This paper presents the design, analysis, and experimental testing results for a 5.67:1 Halbach rotor magnetic gearbox with a ferromagnetic back support. Using 3-D finite element analysis software the Halbach magnetic gearbox was calculated to achieve a volumetric torque density of 284N·m/L with only an active region outer diameter of 120mm. The experimental prototype obtained an active region volumetric torque density of 261.4N·m/L
On Dual-Band Amplifications Using Dual Two-Tones: Clarifications And Discussion, Siyuan Yan, Xianzhen Yang, Xiao Li, Fu Lo
On Dual-Band Amplifications Using Dual Two-Tones: Clarifications And Discussion, Siyuan Yan, Xianzhen Yang, Xiao Li, Fu Lo
Electrical and Computer Engineering Faculty Publications and Presentations
A significant development of recent research in nonlinear distortion is the expansion of the conventional two-tone test for power amplifiers to the concurrent dual-band transmitters, by Amin et al. A general framework using dual two-tones is developed, which shows that the output signal is affected not only by intermodulation (IM) products but also by cross-modulation (CM) products. In this paper, we will make a number of clarifications to Amin et al.'s paper. The effects of IM and CM in passband will be discussed, IM represents a reduction for compressive devices, and CM reflects an interference caused by the signal from …
Assembly Of A 3d Cellular Computer Using Folded E-Blocks, Shivendra Pandey, Nicholas J. Macias, Carmen Ciobanu, Changkyu Yoon, Christof Teuscher, David H. Gracias
Assembly Of A 3d Cellular Computer Using Folded E-Blocks, Shivendra Pandey, Nicholas J. Macias, Carmen Ciobanu, Changkyu Yoon, Christof Teuscher, David H. Gracias
Electrical and Computer Engineering Faculty Publications and Presentations
The assembly of integrated circuits in three dimensions (3D) provides a possible solution to address the ever-increasing demands of modern day electronic devices. It has been suggested that by using the third dimension, devices with high density, defect tolerance, short interconnects and small overall form factors could be created. However, apart from pseudo 3D architecture, such as monolithic integration, die, or wafer stacking, the creation of paradigms to integrate electronic low-complexity cellular building blocks in architecture that has tile space in all three dimensions has remained elusive. Here, we present software and hardware foundations for a truly 3D cellular computational …
Teaching Matlab And C Programming In First Year Electrical Engineering Courses Using A Data Acquisition Device, Phillip Wong, Branimir Pejcinovic
Teaching Matlab And C Programming In First Year Electrical Engineering Courses Using A Data Acquisition Device, Phillip Wong, Branimir Pejcinovic
Electrical and Computer Engineering Faculty Publications and Presentations
Our industry partners often voice a complaint that our newly graduated electrical engineering (EE) students do not have sufficient programming skills. This is not a new concern. In a traditional undergraduate EE curriculum, one or two programming courses compose the entirety of the student’s training in programming. The courses may be taught by the computer science department without significant emphasis on engineering fundamentals. While the principles of computer science may be well covered, the ability to apply the knowledge to practical engineering problems is frequently lacking. To compound the problem, teaching novices the basics of programming can be very challenging …