Open Access. Powered by Scholars. Published by Universities.®
- Institution
- Publication Year
- Publication
- Publication Type
Articles 1 - 30 of 114
Full-Text Articles in Engineering
Characteristic Mode Analysis Prediction And Guidance Of Electromagnetic Coupling Measurements To A Uav Model, Mohamed Z. M. Hamdalla, Benjamin Bissen, James D. Hunter, Yuanzhuo Liu, Victor Khilkevich, Daryl G. Beetner, Anthony N. Caruso, Ahmed M. Hassan
Characteristic Mode Analysis Prediction And Guidance Of Electromagnetic Coupling Measurements To A Uav Model, Mohamed Z. M. Hamdalla, Benjamin Bissen, James D. Hunter, Yuanzhuo Liu, Victor Khilkevich, Daryl G. Beetner, Anthony N. Caruso, Ahmed M. Hassan
Electrical and Computer Engineering Faculty Research & Creative Works
In this work, we study the current coupled to a simplified Unmanned Aerial Vehicle (UAV) model using a dual computational and experimental approach. The simplified surrogate structure reduced the computational burden and facilitated the experimental measurement of the coupled currents. For a practical system, a wide range of simulations and measurements must be performed to analyze the induced current variations with respect to properties of the incident excitation waveform, such as the frequency, angle of incidence, and polarization. To simplify this analysis, Characteristic Mode Analysis (CMA) was used to compute the eigen-currents of the UAV model and predict where and …
Instrumentation, Modeling, And Sound Metamodeling Foundations For Complex Hybrid Systems, Natasha Amelia Jarus
Instrumentation, Modeling, And Sound Metamodeling Foundations For Complex Hybrid Systems, Natasha Amelia Jarus
Doctoral Dissertations
Many of our critical infrastructures, from power grids to water distribution networks, are complex hybrid systems that use software to control their non-trivial physical dynamics. These systems must be able to capably serve their purpose, while also being reliable, dependable, safe, secure, and efficient. Representation and analysis of these features requires the creation of several distinct models. These models may encode design goals or be derived from collected instrumentation data, reflecting both how a system ought to operate and how it does operate. It is essential to ensure that all of these models consistently and accurately describe the same system. …
Emi Characterization For Power Supplies And Machine Learning Based Modeling In Emc/Si, Jiayi He
Emi Characterization For Power Supplies And Machine Learning Based Modeling In Emc/Si, Jiayi He
Doctoral Dissertations
"Signal integrity (SI) and electromagnetic interference (EMI) are essential for consumer electronics and high-speed server applications. It is necessary to do EMI and SI modeling at the design stage. In this research, several modeling approaches for EMI and SI problems are proposed. By using measurement-based modeling method, the mechanism of conducted emissions (CE) on ac to dc power supplies in an LED TV is analyzed. A system-level transient simulation model is built to predict the conducted emission (CE). To characterize the equivalent dipole moment sources in RFI and EMI problems, a dipole source reconstruction method based on machine learning techniques …
Conducted Emi Mitigation In Power Converters Using Active Emi Filters, Balaji Narayanasamy
Conducted Emi Mitigation In Power Converters Using Active Emi Filters, Balaji Narayanasamy
Graduate Theses and Dissertations
Wide bandgap devices enable high power density power converters. Despite the advantages of increased switching frequency, the passive components are still a major bottleneck towards enabling high power density. Among the passive components in the converter, the passive EMI filters are unavoidable to ensure compliance with conducted EMI standards. Active EMI filters help reduce the volume of the passive components and have been around for three decades now. Firstly, this work presents a summary of all the different active EMI filters based on the type of noise-sensing, noise-processing, the type of active circuits used and the type of control methods. …
Ballistic Evaluation Of Carbon Nanotube Sheet Material In Multifunctional Applications, Casey M. Keilbarth
Ballistic Evaluation Of Carbon Nanotube Sheet Material In Multifunctional Applications, Casey M. Keilbarth
Theses and Dissertations
Significant development of carbon nanotubes has occurred since they were first studied in the 1990's. Attempts to capture the phenomenal molecular properties in practical applications are gaining ground as new methods of producing CNTs have been developed. This thesis sought to determine if the addition of commercially produced CNT sheets to thin carbon fiber panels improved the ballistic properties of the panel. The difference between 0 and 4 CNT sheets was studied. The hypothesis was that inte- grating CNT sheets into the laminate would increase the projectile energy absorbed by the panel and reduce the damage to the panel incurred …
Estimating Electromagnetic Emissions From A Site Installation With Multiple Racks Of Server Equipment, Ze Sun
Masters Theses
“There are hundreds, sometimes even thousands, of servers working simultaneously inside a data center. Their radiation can be a problem and cause EMI issues. However, it is not feasible to perform full-wave simulation of these racks because of the large electric size of the model. In this thesis, an algorithm is proposed to predict the emission form rack array. The equivalent dipole source is extracted from EMI measurement data of a single rack and used as the radiation source in the multiple rack model. The coupling between racks cannot be ignored, but through the simulation, it is also found that …
On-Die Transient Event Sensors And System-Level Esd Testing, Abhishek Patnaik
On-Die Transient Event Sensors And System-Level Esd Testing, Abhishek Patnaik
Doctoral Dissertations
"System level electrostatic discharge (ESD) testing of electronic products is a critical part of product certification. Test methods were investigated to develop system level ESD simulation models to predict soft-failures in a system with multiple sensors. These methods rely completely on measurements. The model developed was valid only for the linear operation range of devices within the system. These methods were applied to a commercial product and used to rapidly determine when a soft failure would occur. Attaching cables and probes to determine stress voltages and currents within a system, as in the previous study, is time-consuming and can alter …
A Low Temperature Co-Fired Ceramic (Ltcc) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module, Atanu Dutta
A Low Temperature Co-Fired Ceramic (Ltcc) Interposer Based Three-Dimensional Stacked Wire Bondless Power Module, Atanu Dutta
Graduate Theses and Dissertations
The objective of this dissertation research is to develop a low temperature co-fired ceramic (LTCC) interposer-based module-level 3-D wire bondless stacked power module. As part of the dissertation work, the 3-D wire bondless stack is designed, simulated, fabricated and characterized. The 3-D wire bondless stack is realized with two stand-alone power modules in a half-bridge configuration. Each stand-alone power module consists of two 1200 V 25 A silicon insulated-gate bipolar transistor (IGBT) devices in parallel and two 1200 V 20 A Schottky barrier diodes (SBD) in an antiparallel configuration. A novel interconnection scheme with conductive clamps and a spring loaded …
Planar Electromagnetic Band Gap For Broadband Switching Noise Mitigation In High-Speed Pcb, Kevin H. Nguyen
Planar Electromagnetic Band Gap For Broadband Switching Noise Mitigation In High-Speed Pcb, Kevin H. Nguyen
Theses and Dissertations
Electromagnetic band gap (EBG) structure with novel meandered lines for mitigation of simultaneous switching noise (SSN) from multiple switch mode power supplies on a high speed digital circuit card assembly is investigated. The electromagnetic band gap structure is designed for a wideband operation from 200 MHz to 15 GHz. The application interest for this planar structure can be used as high impedance surfaces to suppress EMI noise for EMC compliance in Mil-Std-461, which is an electromagnetic compatibility standard for military equipment operating in the frequency range from 10 KHz to 18 GHz. ANSYS HFSS was used for simulation of these …
Emp And Geomagnetic Storm Protection Of Critical Infrastructure, George H. Baker Iii
Emp And Geomagnetic Storm Protection Of Critical Infrastructure, George H. Baker Iii
George H Baker
EMP and solar storm wide geographic coverage and ubiquitous system effects beg the question of “Where to begin?” with protection efforts. Thus, in addressing these “wide area electromagnetic (EM) effects,” we must be clever in deciding where to invest limited resources. Based on simple risk analysis, the electric power and communication infrastructures emerge as the highest priority for EM protection. Programs focused on these highest risk infrastructures will go a long way in lessoning societal impact. Given the national scope of the effects, such programs must be coordinated at the national level but implemented at local level. Because wide-area EM …
High Power Electromagnetic Weapons: A Brief Tutorial, George H. Baker Iii
High Power Electromagnetic Weapons: A Brief Tutorial, George H. Baker Iii
George H Baker
High power electromagnetic weapons, also referred to as high power radiofrequency (HPRF) weapons, are a type of directed energy weapons. The system effects of high power electromagnetic environments are well recognized by world scientific and military communities. Former CIA Director John Deutch has said that, "the electron is the ultimate precision-guided weapon." In the course of the investigation ofnuclear EMP effects on electronics during the Cold War period, it became evident that garden variety, unprotected electronics would malfunction, in some cases burn out, in the presence of electromagnetic fields in the hundreds to thousands of volts per meter. The EMP …
Cavities' Identification Algorithm For Power Integrity Analysis Of Complex Boards, S. Cicerone, Antonio Orlandi, Bruce Archambeault, Samuel R. Connor, Jun Fan, James L. Drewniak
Cavities' Identification Algorithm For Power Integrity Analysis Of Complex Boards, S. Cicerone, Antonio Orlandi, Bruce Archambeault, Samuel R. Connor, Jun Fan, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
The analysis and the design of the Power Delivery Network (PDN) is crucial in the real world of high-speed and high-performance on-board systems. In this context, the Cavity Model (where facing portions of power bus are considered electromagnetic resonant cavities) can be used to study the generation and propagation of noise. Given a real-world board's layout, one of the primary requirements for the application of this technique is the geometrical identification of all the cavities and their connectivity. This paper is focused on the fully automatic generation of this geometrical dataset as part of an integrated tool for the analysis …
Automated Near-Field Scanning To Identify Resonances, Giorgi Muchaidze, Huang Wei, Jin Min, Shao Peng, James L. Drewniak, David Pommerenke
Automated Near-Field Scanning To Identify Resonances, Giorgi Muchaidze, Huang Wei, Jin Min, Shao Peng, James L. Drewniak, David Pommerenke
Electrical and Computer Engineering Faculty Research & Creative Works
Near-field scanning systems are a tool for rootcause ESD, EMI, and immunity analysis of electronic systems, as well as qualification methodology for ICs and modules. For emissions, they have developed into a standardized method. Development of universally accepted file formats for data exchange is on-going. Four main types of scanning have been implemented by this and other authors: Near-field EMI scanning, ESD scanning, radiated immunity scanning, and resonance scanning. This article concentrates on resonance scanning as a newly added method for automated EMC system analysis.
Orthogonal Loops Probe Design And Characterization For Near-Field Measurement, Tun Li, Yong Cheh Ho, David Pommerenke
Orthogonal Loops Probe Design And Characterization For Near-Field Measurement, Tun Li, Yong Cheh Ho, David Pommerenke
Electrical and Computer Engineering Faculty Research & Creative Works
Near-field probes are often used to measure the electric and magnetic fields above a printed circuit board in order to identify the sources and coupling paths of an electromagnetic interference (EMI) problem. It is the objective of this paper to propose a rapid E-, Hx- Hy- and circular H-fields measurement using an orthogonal loops probe design. The effects of this probe are analyzed using full-wave simulations and measurements.
Estimating Maximum Radiated Emissions From Printed Circuit Boards With An Attached Cable, Shaowei Deng, Todd H. Hubing, Daryl G. Beetner
Estimating Maximum Radiated Emissions From Printed Circuit Boards With An Attached Cable, Shaowei Deng, Todd H. Hubing, Daryl G. Beetner
Electrical and Computer Engineering Faculty Research & Creative Works
The common-mode current induced on cables attached to printed circuit boards can be a significant source of radiated emissions. Previous studies have shown that coupling from electric and magnetic field sources on circuit boards can be effectively modeled by placing equivalent voltage sources between the board and the cable. The amplitude of these equivalent sources can be estimated by using closed-form equations; however, estimates of the radiated emissions from these board-cable geometries have required full-wave simulations, and full-wave simulation results depend on the exact cable length and placement, which are not normally fixed during radiated emissions testing. This paper develops …
Predictive Modeling Of The Effects Of Skew And Imbalance On Radiated Emi From Cables, J. Chen, James L. Drewniak, Richard E. Dubroff, James L. Knighten, Jun Fan, J. Flavin
Predictive Modeling Of The Effects Of Skew And Imbalance On Radiated Emi From Cables, J. Chen, James L. Drewniak, Richard E. Dubroff, James L. Knighten, Jun Fan, J. Flavin
Electrical and Computer Engineering Faculty Research & Creative Works
This paper provides an approach for predicting the effects of skew and imbalance on radiated emission of cables inside a commercial 19-inch rack-based cabinet. Scattering parameters (S-parameters) for two sets of cable assembly are measured with a four-port vector network analyzer (VNA) and converted into mixed mode S-parameters. Time-domain input signals with different slew rates and different amount of skew are transferred into frequency-domain using fast Fourier transform (FFT). The spectra of radiation emission associated with different inputs are then estimated.
Engineering Of Absorbing Gaskets Between Metal Plates, Marina Koledintseva, Sandeep K. R. Chandra, James L. Drewniak, James A. Lenn
Engineering Of Absorbing Gaskets Between Metal Plates, Marina Koledintseva, Sandeep K. R. Chandra, James L. Drewniak, James A. Lenn
Electrical and Computer Engineering Faculty Research & Creative Works
Engineering of absorbing materials for gaskets that would be used between two metal plates to reduce electromagnetic emissions and improve immunity of electronic equipment is considered. An analytical model of a composite based on the Maxwell Garnett formulation for multiphase mixtures, as well as the shielding effectiveness of this material, are presented. The full-wave numerical computational results for the structure consisting of two overlapping metal plates and an engineered gasket composite material in the place of the overlap are presented.
Common-Mode Radiation Resulting From Hand-Assembled Cable Bundles On Automotive Platforms, Shishuang Sun, James L. Drewniak, David Pommerenke
Common-Mode Radiation Resulting From Hand-Assembled Cable Bundles On Automotive Platforms, Shishuang Sun, James L. Drewniak, David Pommerenke
Electrical and Computer Engineering Faculty Research & Creative Works
A statistical cable harness model is developed to account for the random disturbance of the wire positions along hand-assembled bundles. The non-uniform random bundles are modeled as n-cascaded segments of uniform multi-conductor transmission line. At each section, all wire positions are disturbed with random numbers obeying a Gaussian distribution. In addition, a spline interpolation function is used to improve the smoothness of wires winding along the bundle. The common-mode current distribution along the bundle calculated with SPICE is injected into a full-wave tool, e.g., FDTD, as impressed current sources. Thus, the full-vehicle electromagnetic emissions from the automotive harness can …
Prediction And Measurement Of Radiated Emissions Based On Empirical Time Domain Conducted Measurements, Larry Freeman
Prediction And Measurement Of Radiated Emissions Based On Empirical Time Domain Conducted Measurements, Larry Freeman
Electronic Theses and Dissertations
This thesis develops a novel method to predict radiated emissions measurements. The techniques used are based on standard Electromagnetic Compatibility (EMC) qualification test methods. The empirical data used to formulate the final results was restricted to pertinent data protocol waveforms however the entire method may be applied to any waveforms for which empirical radiated emissions have been measured. The method provides a concise means for predicting worst case radiated emissions profiles based on empirical measured data.
Estimation Of Current From Near-Field Measurement, Haixiao Weng, Daryl G. Beetner, Richard E. Dubroff, Jin Shi
Estimation Of Current From Near-Field Measurement, Haixiao Weng, Daryl G. Beetner, Richard E. Dubroff, Jin Shi
Electrical and Computer Engineering Faculty Research & Creative Works
Knowledge of high-frequency currents in the chip and chip-package are necessary for EMI analysis and prediction, though measurement of these currents may be difficult to obtain in many cases. One possibility is to estimate currents from near-field scan data. In this paper, measurements were made of the magnetic field over a simple circuit and a chip package. The current flowing in the circuit and the chip lead frame was estimated from the compensated near-field data and compared with measurements made directly on the pins. Estimation was performed both with and without structural information of the lead frame. The susceptibility of …
Coupling Between Differential Signals And The Dc Power-Bus In Multilayer Pcbs, Chen Wang, Marco Leone, James L. Drewniak, Antonio Orlandi
Coupling Between Differential Signals And The Dc Power-Bus In Multilayer Pcbs, Chen Wang, Marco Leone, James L. Drewniak, Antonio Orlandi
Electrical and Computer Engineering Faculty Research & Creative Works
Differential and common-mode transfer impedances are proposed herein to analyze noise coupled to (from) the dc power-bus from (to) via transitions in differential signals. Expressions for the two transfer impedances in terms of conventional single-ended transfer impedances are derived and verified through measurements, full-wave finite-difference time-domain (FDTD) simulations and an analytical cavity model. Some properties of the differential and common-mode transfer impedances are investigated to facilitate engineering design. The impact of signal current imbalances on power-bus noise and the benefit of differential signals as compared to single-ended signals are quantified.
Emi Specifics Of Synchronous Dc-Dc Buck Converters, Zhe Li, David Pommerenke
Emi Specifics Of Synchronous Dc-Dc Buck Converters, Zhe Li, David Pommerenke
Electrical and Computer Engineering Faculty Research & Creative Works
DC-DC buck converter topology is widely used in computers and telecom applications because of its high power efficiency and multiple DC levels. However, EMI can be an issue because of its fast switching characteristics and large currents. This paper addresses the analysis of radiated EMI problems associated with DC-DC buck converters and evaluates the effectiveness of solutions that minimize the reverse recovery of the drain-bulk diode of the synchronous switching MOSFET.
Analytical Model For The Rectangular Power-Ground Structure Including Radiation Loss, Ji Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Analytical Model For The Rectangular Power-Ground Structure Including Radiation Loss, Ji Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Electrical and Computer Engineering Faculty Research & Creative Works
An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered in this model. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss printed circuit boards. Measurements are performed to validate the effectiveness of this model.
Calibration And Compensation Of Near-Field Scan Measurements, Masahiro Yamaguchi, Richard E. Dubroff, Kevin P. Slattery, Michael A. Cracraft, Jin Shi
Calibration And Compensation Of Near-Field Scan Measurements, Masahiro Yamaguchi, Richard E. Dubroff, Kevin P. Slattery, Michael A. Cracraft, Jin Shi
Electrical and Computer Engineering Faculty Research & Creative Works
A procedure for the calibration and compensation of near-field scanning is described and demonstrated. Ultimately, the objective is to quantify the individual field components associated with electromagnetic interference (EMI) from high speed circuitry and devices. Specific examples of these methods are shown. The effects of compensation are small but noticeable when the uncompensated output signal from near field scanning is already a very good representation of the field being measured. In other cases, the improvement provided by compensation can be significant when the uncompensated output signal bears little resemblance to the underlying field.
A Study On The Correspondence Of Common-Mode Current In Electromagnetic Radiation From A Pcb With A Guard-Band, Yoshiki Kayano, Motoshi Tanaka, Hiroshi Inoue, James L. Drewniak
A Study On The Correspondence Of Common-Mode Current In Electromagnetic Radiation From A Pcb With A Guard-Band, Yoshiki Kayano, Motoshi Tanaka, Hiroshi Inoue, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A PCB, in which the ground plane has a finite width and the trace has unbalanced positioning, can result in common-mode (CM) radiation. So far, CM current which is generated by the unbalance of a trace and ground plane has been investigated by experiment and numerical method. It was clarified that CM current is well explained the radiation from PCB up to a few hundred megahertz, and addition of a guard band geometry, which is well connected to the ground plane, can be effective in suppressing the CM current. But it is seemed to be insufficient description for the phenomena …
Anticipating Emi And On-Board Interference In Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen
Anticipating Emi And On-Board Interference In Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen
Electrical and Computer Engineering Faculty Research & Creative Works
A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, …
Extraction Of Spice-Type Equivalent Circuits Of Signal Via Transitions Using The Peec Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, Antonio Orlandi
Extraction Of Spice-Type Equivalent Circuits Of Signal Via Transitions Using The Peec Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, Antonio Orlandi
Electrical and Computer Engineering Faculty Research & Creative Works
Digital devices and discontinuities are typically analyzed by inserting their equivalent circuits into SPICE-type simulators. The partial element equivalent circuit method has been proven to be very useful for electromagnetic modeling. It can be used in both the time and the frequency domain. In this paper, the PEEC technique is employed as an efficient full-wave modeling tool to derive SPICE-type equivalent circuits of signal via transition structures. A nodal analysis technique is utilized in conjunction with the optimization algorithm to extract the equivalent circuits, whose component values are the parameters optimized. The good agreement between different approaches demonstrates that the …
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Electrical and Computer Engineering Faculty Research & Creative Works
Radiated emission algorithms for a printed circuit board EMC expert system are described. The expert system mimics the thinking processes that human EMC engineers would use to analyze circuit boards and make design recommendations. Working with limited information about the enclosure, cables or the exact nature of the signals, the expert system evaluates different structures on the printed circuit board looking for potentially strong radiated emission sources. Results obtained from the analysis of a sample printed circuit board are provided to demonstrate how the expert system quickly identifies problems that would otherwise be difficult to locate.
Multilevel Inverters With Equal Or Unequal Sources For Dual-Frequency Induction Heating, B. Diong, S. Basireddy, Keith Corzine, Yakov L. Familiant
Multilevel Inverters With Equal Or Unequal Sources For Dual-Frequency Induction Heating, B. Diong, S. Basireddy, Keith Corzine, Yakov L. Familiant
Electrical and Computer Engineering Faculty Research & Creative Works
Most existing power supplies for induction heating equipment produce voltage at a single (adjustable) frequency. Recently, however, induction heating power supplies that produce voltage at two (adjustable) frequencies have been researched and even commercialized. Dual-frequency power supplies are a significant development for heat-treating workpieces with uneven geometries, such as gears, since different portions of such workpieces are heated dissimilarly at a single frequency and so require a two step process using a single-frequency power supply. On the other hand, a dual-frequency power supply can achieve the desired result for such workpieces in a one step process. This paper proposes the …
Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI …