Engineering Commons^™

Electroplating On 3d Printed Conductive Track, Kishore Kumar Kadari

USF Tampa Graduate Theses and Dissertations

There are substantial advances in Additive Manufacturing (AM) technologies. The simplest and advantageous technique of AM in terms of cost and scaling of the substrate is Fused Deposition Modeling(FDM). Currently, integration of electronics to a 3D printed structure is done manually after fabrication of the structure. To print electronic circuits directly on a 3D printed structure, copper electroplating process has been studied in this work.

To electroplate on the 3D printed insulating substrate, various materials were studied to make substrate conductive. By using conductive Polylactic Acid (PLA) filaments, a compatible substrate for electroplating was printed. Electroplating was proved to be …

Electrodeposition Of Ruo2 Layers On Tio2 Nanotube Array Toward Co2 Electroreduction, Bei Jiang, Lina Zhang, Xianxian Qin, Wenbin Cai

Journal of Electrochemistry

RuO₂/TiO₂ composite materials have multitude of electrocatalytic applications including but not limited to CO₂ reduction reaction (CO₂RR). RuO₂/TiO₂ electrodes were previously prepared by repetitive coating and thermal decomposition (TD) of a Ru(III) precursor solution on Ti substrate. In this work, electrochemical potential cycling is applied to deposit amorphous RuO₂ (α-RuO₂) layers onto TiO₂ nanotube array (TNA) (RuO₂^CV/TNA) preformed on Ti foil. SEM, GIXRD, and voltammetry are applied to characterize the structures of the resulting Ru_O2^CV/TNA. Ru loading on the RuO_{2 …}