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Full-Text Articles in Engineering
Extracting R, L, G, C Parameters Of Dispersive Planar Transmission Lines From Measured S-Parameters Using A Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, James L. Drewniak, Giulio Antonini, Antonio Orlandi, Konstantin Rozanov
Extracting R, L, G, C Parameters Of Dispersive Planar Transmission Lines From Measured S-Parameters Using A Genetic Algorithm, Jianmin Zhang, Marina Koledintseva, James L. Drewniak, Giulio Antonini, Antonio Orlandi, Konstantin Rozanov
Electrical and Computer Engineering Faculty Research & Creative Works
Signal integrity (SI) analysis of printed circuit boards for high-speed digital design requires information on the perunit-length R, L, G, C parameters of the transmission lines. However, these are not always available when the property of the dielectric medium used in the board is unknown. A method to extract R, L, G, and C parameters from parallel-plate and strip transmission line geometries is proposed. It is based on measured scattering parameters and analytical modeling. A genetic algorithm (GA) is used to optimize the extraction by minimizing the frequency domain discrepancy between an objective function, which is the measured scattering matrix …
Comparison Of Via Equivalent Circuit Model Accuracy Using Quasi-Static And Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, Albert E. Ruehli
Comparison Of Via Equivalent Circuit Model Accuracy Using Quasi-Static And Full-Wave Approaches, Bruce Archambeault, Samuel R. Connor, Jianmin Zhang, James L. Drewniak, Mauro Lai, Antonio Orlandi, Giulio Antonini, Albert E. Ruehli
Electrical and Computer Engineering Faculty Research & Creative Works
The EMC and signal integrity impact of printed circuit board (PCB) trace discontinuities, such as vias, where the signal is transitioned from one layer to another in the PCB stackup, have become significant recently with the use of very high speed signals in today''s systems. If these discontinuities are ignored, significant distortion of the high speed signal can occur, and in many cases, cause data errors. A fast and accurate technique to include the effect of via discontinuities in the typical design process is needed to ensure this distortion is considered if significant. Therefore, a simple equivalent circuit for the …
Effects Of Open Stubs Associated With Plated Through-Hole Vias In Backpanel Designs, Shaowei Deng, Jingkun Mao, Todd H. Hubing, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Chen Wang
Effects Of Open Stubs Associated With Plated Through-Hole Vias In Backpanel Designs, Shaowei Deng, Jingkun Mao, Todd H. Hubing, James L. Drewniak, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander, Chen Wang
Electrical and Computer Engineering Faculty Research & Creative Works
Plated through-hole (PTH) vias are commonly used in printed circuit boards. They usually leave open stubs if the signal(s) does not transition the entire depth of the board. These open stubs can have a negative impact on signal transmission. This summary reports the investigation of the impact of the open via stubs in a typical backpanel design.
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Electrical and Computer Engineering Faculty Research & Creative Works
Radiated emission algorithms for a printed circuit board EMC expert system are described. The expert system mimics the thinking processes that human EMC engineers would use to analyze circuit boards and make design recommendations. Working with limited information about the enclosure, cables or the exact nature of the signals, the expert system evaluates different structures on the printed circuit board looking for potentially strong radiated emission sources. Results obtained from the analysis of a sample printed circuit board are provided to demonstrate how the expert system quickly identifies problems that would otherwise be difficult to locate.
Extraction Of A Spice Via Model From Full-Wave Modeling For Differential Signaling, Shaofeng Luan, Giuseppe Selli, James L. Drewniak, Andrea De Luca, Giulio Antonini, Antonio Orlandi, Antonio Ciccomancini Scogna, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander
Extraction Of A Spice Via Model From Full-Wave Modeling For Differential Signaling, Shaofeng Luan, Giuseppe Selli, James L. Drewniak, Andrea De Luca, Giulio Antonini, Antonio Orlandi, Antonio Ciccomancini Scogna, Jun Fan, James L. Knighten, Norman W. Smith, Ray Alexander
Electrical and Computer Engineering Faculty Research & Creative Works
This paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation.
Common-Mode Current Due To A Trace Near A Pcb Edge And Its Suppression By A Guard Band, Yoshiki Kayano, Motoshi Tanaka, James L. Drewniak, Hiroshi Inoue
Common-Mode Current Due To A Trace Near A Pcb Edge And Its Suppression By A Guard Band, Yoshiki Kayano, Motoshi Tanaka, James L. Drewniak, Hiroshi Inoue
Electrical and Computer Engineering Faculty Research & Creative Works
The common-mode (CM) current due to a trace near a printed circuit board (PCB) edge, and its suppression by a guard band have been studied experimentally and with finite-difference time-domain (FDTD) modeling. As the guard band, copper tape is connected along the entire edge of the ground plane. First, a PCB electromagnetic interference (EMI) coupling path that results from the nonzero impedance of the PCB ground plane is discussed. As the trace is moved closer to the PCB edge, the CM current increases. Then, the effect of the guard band on the CM current is detailed. A guard band parallel …