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Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI …